Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
AssigneesKabushiki Kaisha Toshiba, Ebara Corporation
InventorsKatsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
Life of this patent
Estimating the term…
Abstract
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
Claims35
An apparatus for use in manufacturing a semiconductor device, said apparatus comprising:
- a polishing system for polishing a semiconductor wafer to be polished to form a polished semiconductor wafer;
- a washing system for washing the polished semiconductor wafer to form a clean polished workpiece;
- a drying system for drying the clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
- an enclosing structure enclosing said polishing system, said washing system and said drying system and thereby forming therewith a unit that is selectively movable in location and that operates to prevent escape of an atmosphere within said enclosing structure to an atmosphere surrounding said enclosing structure;
- an unloading unit for receiving the clean and dry polished semiconductor wafer;
- and
- transfer structure for transferring the polished semiconductor wafer from said polishing system to said washing system and for transferring the clean and dry polished semiconductor wafer from said drying system to said unloading unit.
A polishing apparatus comprising:
- a single loading/unloading unit both for receiving workpieces to be polished and for receiving polished workpieces;
- a plurality of turntables having respective polishing surfaces;
- a plurality of top rings for holding workpieces against respective said polishing surfaces to thereby polish the workpieces;
- and
- a transfer structure, positioned to be accessible to said loading/unloading unit and said turntables, both to transfer workpieces to be polished between said loading/unloading unit and said turntables and to transfer polished workpieces to said loading/unloading unit.
An apparatus for use in manufacturing a semiconductor device, said apparatus comprising:
- an enclosing structure capable of containing and preventing an atmosphere within said enclosing structure for escaping therefrom to exterior thereof;
- a loading unit for receipt of a semiconductor wafer to be polished;
- a polishing system within said enclosing structure for polishing the semiconductor wafer to form a polished semiconductor wafer;
- a washing system within said enclosing structure for washing the polished semiconductor wafer to form a clean polished semiconductor wafer;
- a drying system within said enclosing structure for drying the clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
- an unloading unit for receiving the clean and dry polished semiconductor wafer;
- and
- transfer structure for transferring the polished semiconductor wafer from said polishing system to said washing system and for transferring the clean and dry polished semiconductor wafer from said drying system to said unloading unit.
A method for polishing and then washing a semiconductor wafer said method comprising:
- introducing said semiconductor wafer from the interior of a clean room into an enclosing structure installed in said clean room;
- polishing said semiconductor wafer to form a polished semiconductor wafer;
- washing said polished semiconductor wafer to form a clean polished semiconductor wafer;
- drying said clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
- removing said clean and dry polished semiconductor wafer from said enclosing structure to said interior of said clean room;
- and
- transferring the semiconductor wafer by at least one robot after said introducing and before said removing.
A method for polishing and then washing a semiconductor wafer, said method comprising:
- introducing said semiconductor wafer from the interior of a clean room into an enclosing structure installed in said clean room;
- polishing said semiconductor wafer to form a polished semiconductor wafer;
- washing said polished semiconductor wafer at plural washing operations to form a clean polished semiconductor wafer;
- spin-drying said clean polished semiconductor wafer to form a clean and dry polished semiconductor wafer;
- and
- removing said clean and dry polished semiconductor wafer from said enclosing structure to said interior of said clean room.
Dependencies are inferred from the claim text.