US 6,273,800 B1 · Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates

Abstract

A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Claims15

Dependent claims

An apparatus for supporting a polishing pad during planarization of a microelectronic substrate, comprising:

an elongated at least partially compressible support pad having a first surface for engaging the polishing pad and a second surface opposite the first surface;
and
a platen attached to the second surface of the support pad, the platen being generally incompressible in a direction generally perpendicular to the second surface of the support pad, at least a portion of the platen and the support pad being movable with the polishing pad when the first surface of the support pad engages the polishing pad.

Dependencies are inferred from the claim text.

Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates

Life of this patent

Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates

Life of this patent

Abstract

Claims15