Apparatus and method for grinding a semiconductor wafer surface

A semiconductor wafer fabrication apparatus comprising:

• a carrier head for holding a wafer and distributing a downward pressure across a back surface of the wafer;
• a wafer processing station, wherein the station includes:
• a polishing surface;
• and
• a fluid bearing for providing an upward pressure against a front surface of the wafer so as to substantially flatten the front surface of the wafer, wherein the polishing surface can be raised into contact with the front surface of the wafer and moved relative to the wafer to polish the front surface while the carrier head distributes the downward pressure across the back surface of the wafer.

A method of polishing a semiconductor wafer, the method comprising:

• positioning the wafer over fluid bearing surface areas separated by a gap, wherein the fluid bearing surface areas have openings through which a fluid flows to provide an upward pressure against a front surface of the wafer;
• providing a substantially uniform pressure against a back surface of the wafer;
• positioning a polishing surface at least partially in the gap and in contact with the front surface of the wafer;
• and
• moving the polishing surface against the front surface of the wafer.