Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing
AssigneeSpeedFam-IPEC Corporation
InventorMark Meloni
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Abstract
Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing are disclosed. The chemical mechanical polishing apparatus includes a platen having a polishing material attached thereto and a distance measurement device attached to the platen. The distance measurement device includes a light source and a light sensor. Distance between the device and the workpiece is measured by transmitting light through apertures formed within the platen and the polishing material toward the workpiece and focusing the light reflected from the workpiece on an element within the sensor.
Claims6
A chemical mechanical polishing apparatus configured to collect workpiece displacement information while processing the workpiece, said apparatus comprising:
- a chemical mechanical polishing machine;
- and
- a distance measuring device attached to a portion of said chemical mechanical polishing machine, said device configured to transmit light toward the workpiece to measure a distance between a point on the workpiece and said device.
Dependencies are inferred from the claim text.