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US 6,273,700 B1Granted
Mold structure used in method of molding circuitry
AssigneeYazaki Corporation
InventorToshiharu Takahashi
Life of this patent
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Abstract
A mold structure for molding a circuitry comprises a cavity to which a plurality of bus bars are juxtaposedly inserted provided with gap portions to which a resin material to be injected therethrough; and a plurality of holder pins provided on the respective gap portions and arranged alternatively in the juxtaposition direction of the plural bus bars to hold the respective bus bar to be inserted therebetween.
Claims3
A mold structure for molding circuitry comprising:
- a mold member having a cavity into which a plurality of bus bars are juxtaposedly inserted, the bus bars being provided with gap portions into which resin material is to be injected;
- and
- a plurality of holder pins provided in the respective gap portions and arranged alternatively in the juxtaposition direction of the plural bus bars to hold the respective bus bar therebetween.
Dependencies are inferred from the claim text.