Exposure method and X-ray mask structure for use with the same

A mask structure for use in printing a pattern on a workpiece to be exposed, said mask structure comprising:

• a first absorbing material pattern having no periodic structure, wherein a transferred image of the first absorbing material pattern can be formed on the workpiece;
• a second absorbing material pattern having a periodic structure, wherein a diffraction pattern of a period corresponding to 1/n of the period of the transferred image of the periodic structure pattern, where n is an integer not less than 2, which diffraction pattern is to be produced through Fresnel diffraction due to the second absorbing material pattern, can be printed on the workpiece.

A device, comprising:

• a substrate;
• and
• a pattern formed on the substrate in accordance with a procedure which includes (i) an exposure process for printing a pattern onto a workpiece to be exposed, the exposure process including (a) a first exposure step for forming, on the workpiece and by exposure, a transferred image of a first absorbing material pattern formed on a mask and having no periodic structure, and (b) a second exposure step for printing, on the workpiece and by exposure, a diffraction pattern to be produced through Fresnel diffraction due to a second absorbing material pattern formed on the mask and having a periodic structure, the diffraction pattern having a period corresponding to 1/n of a period of the transferred image of the periodic structure pattern, where n is an integer not less than 2, and wherein the first and second exposure steps are performed simultaneously, and (ii) a development process for developing the pattern exposed workpiece, so that a circuit pattern can be formed on the workpiece.

A device manufacturing method, comprising:

• an exposure process for printing a pattern onto a workpiece to be exposed, the exposure process including (i) a first exposure step for forming, on the workpiece and by exposure, a transferred image of a first absorbing material pattern formed on a mask and having no periodic structure, and (ii) a second exposure step for printing, on the workpiece and by exposure, a diffraction pattern to be produced through Fresnel diffraction due to a second absorbing material pattern formed on the mask and having a periodic structure, the diffraction pattern having a period corresponding to 1/n of a period of the transferred image of the periodic structure pattern, where n is an integer not less than 2, and wherein the first and second exposure steps are performed simultaneously;
• and
• a development process for developing the pattern exposed workpiece, so that a circuit pattern can be formed on the workpiece.