Exposure apparatus and device manufacturing method including changing a photo-intensity distribution of a light source and adjusting an illuminance distribution on a substrate in accordance with the change
AssigneeCanon Kabushiki Kaisha
InventorsAkiyoshi Suzuki, Miyoko Noguchi
Life of this patent
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Abstract
An exposure apparatus and a device manufacturing method for transferring a device pattern on a substrate by illuminating the device pattern with light from a light source include features of changing a photointensity distribution of the light source and adjusting an illuminance distribution on the substrate in accordance with a change of the photointensity distribution.
Claims32
An exposure apparatus comprising:
- a light source for emitting light;
- providing means for providing, with light from said light source, a secondary light source, having a variable shape;
- projecting means for projecting light from the secondary light source through a mask having a pattern to a substrate to be exposed;
- and
- adjusting means for adjusting an illuminance distribution on the substrate, in accordance with the variation of the shape of the secondary light source.
An exposure apparatus comprising:
- a light source for emitting light;
- providing means for providing, with light from said light source, a secondary light source, having a variable shape;
- projecting means for projecting the light from the secondary light source onto a substrate through a mask having a pattern;
- and
- changing means for changing an illuminance non-uniformity on the mask, in accordance with the variation in the shape of the secondary light source.
A projection exposure apparatus comprising:
- a light source for producing light;
- an optical integrator for receiving the light from said light source;
- a first optical system for directing the light from said light source to said optical integrator to form a secondary light source;
- aperture stop means for defining a shape of the secondary light source, said aperture stop means comprising a plurality of aperture stops having different aperture shapes, respectively, the shape of the secondary light source being defined by providing one of the aperture stops into an optical path of said light source;
- a second optical system for illuminating a mask with the light from the secondary light source;
- a projection optical system for projecting a pattern of the mask, illuminated by said second optical system, onto a substrate;
- and
- adjusting means for adjusting an illuminance distribution on the substrate, in accordance with an exchange of the aperture stop.
A projection exposure apparatus comprising:
- a light source for producing light;
- an optical integrator for receiving the light from said light source;
- a first optical system for directing the light from said light source to said optical integrator to form a secondary light source;
- aperture stop means for defining a shape of the secondary light source, said aperture stop means comprising a plurality of aperture stops having different aperture shapes, respectively, the shape of the secondary light source being defined by providing one of the aperture stops into an optical path of said light source;
- a second optical system for illuminating a mask with the light from the secondary light source;
- a projection optical system for projecting a pattern of the mask, illuminated by said second optical system, onto a substrate;
- and
- changing means for changing an illuminance non-uniformity on the mask, in accordance with an exchange of the aperture stop.
A device manufacturing method including a step of transferring a device pattern of a mask onto a substrate by illuminating the mask with light from a light source, said method comprising the steps of:
- emitting light from a light source;
- providing, with light from the light source, a secondary light source having a variable shape;
- and
- adjusting an illuminance distribution on the substrate, in accordance with the variation of the shape of the secondary light source.
A device manufacturing method including a step of transferring a device pattern of a mask onto a substrate by illuminating the mask with light from a light source, said method comprising the steps of:
- emitting light from a light source;
- providing, with light from the light source, a secondary light source having a variable shape;
- and
- changing an illuminance non-uniformity distribution on the mask, in accordance with the change in the shape of the light source.
A device manufacturing method comprising:
- producing light by a light source;
- receiving the light from the light source by an optical integrator;
- directing the light from the light source to the optical integrator, using a first optical system, to form a secondary light source;
- defining a shape of the secondary light source using aperture stop means, the aperture stop means having a plurality of aperture stops having different aperture shapes, respectively, and defining the shape of the secondary light source by providing one of the aperture stops into an optical path of the light source;
- illuminating a mask with the light from the secondary light source using a second optical system;
- projecting a pattern of the mask illuminated by the second optical system, onto a substrate, using a projection optical system;
- adjusting an illuminance distribution on the substrate using adjusting means, in accordance with an exchange of the aperture stop;
- and
- transferring the pattern of the mask onto the substrate.
A device manufacturing method comprising:
- producing light by a light source;
- receiving the light from the light source by an optical integrator;
- directing the light from the light source to the optical integrator, using a first optical system, to form a secondary light source;
- defining a shape of the secondary light source using aperture stop means, the aperture stop means having a plurality of aperture stops having different aperture shapes, respectively, and defining the shape of the secondary light source by providing one of the aperture stops into an optical path of the light source;
- illuminating a mask with the light from the secondary light source using a second optical system;
- projecting a pattern of the mask illuminated by the second optical system, onto a substrate, using a projection optical system;
- changing an illuminance non-uniformity on the mask using adjusting means, in accordance with an exchange of the aperture stop;
- and
- transferring the pattern of the mask onto the substrate.
Dependencies are inferred from the claim text.