Divided voltage de-coupling structure
AssigneeIntel Corporation
InventorRaj Nair
Life of this patent
Estimating the term…
Abstract
The present invention provides an integrated circuit (I.C.) with a de-coupling circuit. The de-coupling circuit includes a voltage divider that includes first and second divider elements. The first and second divider elements are coupled to positive and negative supply voltages, respectively. The first and second divider elements are coupled therebetween at a central node. The de-coupling circuit further includes a PMOSFET transistor and a NMOSFET transistor that have their gates coupled at the node. The PMOSFET and NMOSFET transistors have their sources, drains, and bulks thereof coupled to the positive and negative supply voltages, respectively.
Claims22
In an integrated circuit, a de-coupling circuit comprising:
- a voltage divider including first and second divider elements coupled to positive and negative supply voltages respectively, said first and second divider elements coupled therebetween at a node;
- and
- a p-channel Metal Oxide Semiconductor Field Effect Transistor (PMOSFET) and an n-channel Metal Oxide Semiconductor Field Effect Transistor (NMOSFET) that have their gates coupled at said node, said PMOSFETs and NMOSFETs have sources, drains, and bulks thereof coupled to said positive and negative supply voltages respectively,
- wherein said decoupling circuit is formed on a single integrated circuit substrate, and
- wherein said first and second elements include first and second diode-connected transistors respectively, coupled between said positive and negative supply voltages and adapted to operate in a sub-threshold conduction configuration.
In an integrated circuit, a de-coupling circuit comprising:
- a voltage divider including first and second divider elements coupled to positive and negative supply voltages respectively, said first and second divider elements coupled therebetween at a node;
- and
- a p-channel Metal Oxide Semiconductor Field Effect Transistor (PMOSFET) and an n-channel Metal Oxide Semiconductor Field Effect Transistor (NMOSFET) that have their gates coupled at said node, said PMOSFETs and NMOSFETs have sources, drains, and bulks thereof coupled to said positive and negative supply voltages respectively,
- wherein said decoupling circuit is formed on a single integrated circuit substrate, and
- wherein said first and second elements include first and second diode-connected p-type MOSFET transistors coupled between said positive and negative supply voltages.
In an integrated circuit, a de-coupling circuit comprising:
- a voltage divider including first and second elements coupled to positive and negative supply voltages respectively, said first and second elements coupled therebetween at a node;
- and
- first and second p-channel Metal Oxide Semiconductor Field Effect Transistors (PMOSFETs) said first PMOSFET having a gate thereof coupled to said node and a drain, source, and bulk thereof coupled to said positive supply voltage, said second PMOSFET having a source, drain, and bulk thereof coupled to said node and said gate thereof coupled to said negative supply voltage,
- wherein the decoupling circuit is formed on a single integrated circuit substrate, and
- wherein said first and second elements include first and second diode-connected p-type MOSFET transistors coupled between said positive and negative supply voltages.
In an integrated circuit, a decoupling circuit comprising:
- a voltage divider including first and second elements coupled to positive and negative supply voltages respectively, said first and second elements coupled therebetween at a node;
- and
- first and second p-channel Metal Oxide Semiconductor Field Effect Transistors (PMOSFETs) said first PMOSFET having a gate thereof coupled to said node and a drain, source, and bulk thereof coupled to said positive supply voltage, said second PMOSFET having a source, drain, and bulk thereof coupled to said node and said gate thereof coupled to said negative supply voltage,
- wherein the decoupling circuit is formed on a single integrated circuit substrate,
- wherein said first and second elements include first and second diode-connected transistors respectively, coupled between said positive and negative supply voltages and adapted to operate in a sub-threshold conduction configuration.
In a system having an integrated circuit that includes a power supply and a load circuit, a decoupling circuit is coupled to the power supply and the load circuit, the decoupling circuit comprising:
- a voltage divider including first and second divider elements coupled to positive and negative supply voltages respectively, said first and second divider elements coupled therebetween at a node, and
- a p-channel Metal Oxide Semiconductor Field Effect Transistor (PMOSFET) and an n-channel Metal Oxide Semiconductor Field Effect Transistor (NMOSFET) that have their gates coupled at said node, said PMOSFETs and NMOSFETs have sources, drains, and bulks thereof coupled to said positive and negative supply voltages respectively,
- wherein the decoupling circuit is formed on a single integrated circuit substrate,
- wherein said first and second elements include first and second diode-connected p-type MOSFET transistors coupled between said positive and negative supply voltages.
In a system having an integrated circuit that includes a power supply and a load circuit, a de-coupling circuit is coupled to the power supply and the load circuit, the decoupling circuit comprising:
- a voltage divider including first and second divider elements coupled to positive and negative supply voltages respectively, said first and second divider elements coupled therebetween at a node, and
- a p-channel Metal Oxide Semiconductor Field Effect Transistor (PMOSFET) and an n-channel Metal Oxide Semiconductor Field Effect Transistor (NMOSFET) that have their gates coupled at said node, said PMOSFETs and NMOSFETs have sources, drains, and bulks thereof coupled to said positive and negative supply voltages respectively,
- wherein the decoupling circuit is formed on a single integrated circuit substrate,
- wherein said first and second elements include first and second diode-connected transistors respectively, coupled between said positive and negative supply voltages and adapted to operate in a sub-threshold conduction configuration.
Dependencies are inferred from the claim text.