Multi-chip module testability using poled-polymer interlayer dielectrics

A method for non-invasive testability of a multi-module circuit structure, comprising the steps of:

• a) forming a multi-module circuit structure including a plurality of chromophore doped polyimide dielectric layers formed on a metal layer and substrate;
• b) forming patterned metal conductors on each of the plurality of chromophore doped polyimide dielectric layers;
• c) poling the chromophore doped polyimide dielectric layers in a strong electric field;
• and
• d) focusing a laser probe near or on each of the patterned metal conductors for diagnosing module performance.

A method for non-invasive testability of a multi-module circuit structure, comprising the steps of:

• a) forming a multi-module circuit structure including a plurality of chromophore doped polyimide dielectric layers formed on a metal layer and substrate;
• b) forming patterned metal conductors on each of the plurality of chromophore doped polyimide dielectric layers;
• c) poling the chromophore doped polyimide dielectric layers in a strong electric field;
• and
• d) electro-optic probing the multi-module circuit structure for measuring changes in the index of refraction of the chromophore doped polyimide dielectric layers due to a change in the local electric field.