Integrated circuit sample package for checking electrical functionality and alignment of checking devices and corresponding checking method
AssigneeSTMicroelectronics S.r.l.
InventorEnzo Ferradino
Life of this patent
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AssigneeSTMicroelectronics S.r.l.
InventorEnzo Ferradino
Estimating the term…
An integrated circuit sample package is provided for checking electrical functionality and alignment of a checking device. The checking device includes a contactor and equipment for checking mechanical and electrical features of at least one integrated circuit device. The integrated circuit sample package substantially reproduces the external envelope of the integrated circuit device and is manufactured from an electrical conducting material that is resistant to mechanical wear. In one preferred embodiment, the integrated circuit sample package includes a body that substantially reproduces the external envelope of the body of the integrated circuit device, and offshoots that substantially reproduce the external envelope of the terminals of the integrated circuit device. A method for checking electrical functionality and alignment of a checking device is also provided. According to the method, an integrated circuit sample package that reproduces only the external envelope of the integrated circuit device is used in the checking. The integrated circuit sample package is manufactured from an electrical conducting material that is resistant to mechanical wear.
An integrated circuit sample package for use in checking a checking device, the checking device including a contactor for contacting terminals of a real integrated circuit device package during normal operation, said integrated circuit sample package comprising:
A method for checking a checking device having a plurality of contacts, the checking device being of the type used for checking a real integrated circuit device package during normal operation, said method comprising the step of:
Dependencies are inferred from the claim text.