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US 6,271,617 B1Granted
Surface acoustic wave device with a tungsten-aluminum layered interdigital transducer
AssigneeMurata Manufacturing Co., Ltd.
InventorsToshimaro Yoneda, Michio Kadota
Life of this patent
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Abstract
A surface acoustic wave device includes a surface acoustic wave substrate and an interdigital transducer provided on the surface acoustic wave substrate and including a laminated metal film in which a tungsten layer and an aluminum layer are laminated.
Claims20
A surface acoustic wave device, comprising:
- a surface acoustic wave substrate;
- and
- an interdigital transducer provided on the surface acoustic wave substrate and including a tungsten layer and an aluminum layer, wherein a ratio of a thickness of the tungsten layer to the aluminum layer is in a range of about 10:1 to about 2:1.
A surface acoustic wave device, comprising:
- a surface acoustic wave substrate;
- an interdigital transducer provided on the surface acoustic wave substrate;
- and
- at least two reflectors disposed on opposite sides of the interdigital transducer, wherein at least one of the at least two reflectors is made of a different material than the interdigital transducer, and at least one of the at least two reflectors including a tungsten layer and an aluminum layer.
1 more element
Dependencies are inferred from the claim text.