Wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate
AssigneeInternational Business Machines Corporation
InventorsBirendra N. Agarwala, William H. Ma
Life of this patent
Estimating the term…
Abstract
A wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate and a process for manufacturing the same. The wire interconnect structure comprises an insulator layer disposed on an integrated circuit chip and an electrically conductive post extending through the insulator layer to the integrated circuit chip. The post has an elongated body, a bottom at one end of the body which is mechanically and electrically connected to the integrated circuit chip, and a top having a spherical shape at the opposite end of the body which extends outward from the insulator layer.
Claims11
A wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate, said wire interconnect structure comprising:
- an electrically conductive post having:
- an elongated body having a first end and a second end, with a length between the first end and the second end, and the length being greater than the diameter of the elongated body;
- a bottom at said first end of said body, said bottom mechanically and electrically connected to said integrated circuit chip;
- and
- a top at said second end of said body of the same material as and formed from said body and having a spherical shape, and adapted to electrically and mechanically connect to the substrate;
- and
- an insulator layer disposed on said integrated circuit chip surrounding said post and from which said top of said post projects and of a flexible material that permits said post to flex to accommodate a thermal mismatch between said integrated circuit chip and said substrate.
Dependencies are inferred from the claim text.