Back to results
US 6,271,588 B1Granted
Semiconductor device and manufacturing method thereof
AssigneeOki Electric Industry Co., Ltd.
InventorShinji Ohuchi
Life of this patent
Estimating the term…
Abstract
Protective tape is bonded onto a rear surface of a semiconductor element prior to a resin sealing step, and then only a primary surface of the semiconductor element is sealed with a resin layer. Cracks and warping which would otherwise be caused by an external force or foreign matter at an exposed rear surface of the semiconductor element are prevented. This facilitates a surface polishing step and also results in a lower profile for the semiconductor device, because the rear surface is not sealed with resin.
Claims16
A semiconductor device comprising:
- a semiconductor element;
- an electrode pad formed at a primary surface of said semiconductor element;
- a resin layer formed at said primary surface at which said electrode pad is formed;
- a means for electrical connection that electrically connects said electrode pad to an external connection terminal;
- and
- protective tape bonded onto a rear surface of said semiconductor element.
3 more elements
A semiconductor device comprising:
- a semiconductor element having a first surface and a second surface, the first surface being an opposite surface with respect to the second surface of the semiconductor element;
- an electrode formed at the first surface of the semiconductor element;
- a wiring portion formed on the first surface of the semiconductor element and connected to the electrode;
- a conductive post formed on the first surface of the semiconductor element and connected to the wiring portion;
- a resin layer formed on the first surface of the semiconductor element so as to cover the first surface of the semiconductor element, the wiring portion and a side of the conductive post;
- an external connection terminal formed on the conductive post;
- and
- a protective layer bonded on the second surface of the semiconductor element.
5 more elements
A semiconductor device comprising:
- a semiconductor element having a first surface and a second surface, the first surface being an opposite surface with respect to the second surface of the semiconductor element;
- an electrode formed at the first surface of the semiconductor element;
- a wiring portion formed on and along the first surface of the semiconductor element and connected to the electrode;
- a conductive post formed on the first surface of the semiconductor element and connected to the wiring portion;
- a resin layer formed on the first surface of the semiconductor element so as to cover the first surface of the semiconductor element, the wiring portion and a side of the conductive post;
- an external connection terminal formed on the conductive post;
- and
- a protective layer bonded on the second surface of the semiconductor element,
- a side of the semiconductor element being exposed from the resin layer and the protective layer.
6 more elements
A semiconductor device comprising:
- a semiconductor element having a first surface and a second surface, the first surface being an opposite surface with respect to the second surface of the semiconductor element;
- an electrode formed at the first surface of the semiconductor element;
- a wiring portion formed on and along the first surface of the semiconductor element and connected to the electrode;
- a conductive post having a first end portion and a second end portion, and being formed on the first surface of the semiconductor element, the first end portion of the conductive post being connected to the wiring portion;
- a resin layer formed on the first surface of the semiconductor element so as to cover the first surface of the semiconductor element, the wiring portion and a side of the conductive post, the second end portion of the conductive post not being covered by the resin layer;
- an external connection terminal formed on the second end of the conductive post;
- and
- a protective layer bonded on the second surface of the semiconductor element,
- only a side of the semiconductor element being exposed from the resin layer and the protective layer.
6 more elements
Dependencies are inferred from the claim text.