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US 6,271,583 B1Granted
Semiconductor device having resin encapsulated package structure
AssigneeFujitsu Limited
InventorsHideharu Sakoda, Yoshiyuki Yoneda, Kazuto Tsuji
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor part which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode pads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, a part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.
Claims10
A semiconductor device comprising:
- a substrate having a first surface and a second surface, and made of an electrode member with a majority of a total volume thereof being a conductor material;
- a semiconductor chip provided on the first surface of said substrate and having a plurality of electrode pads;
- a plurality of leads, each spaced apart from the first surface of said substrate;
- a plurality of connecting means for electrically connecting said leads and said substrate to corresponding ones of the electrode pads of said semiconductor chip;
- a resin package encapsulating said semiconductor chip, respective parts of said leads and said substrate, wherein a portion of the second surface of said substrate remains uncovered by said resin package;
- and
- an electric cord, wherein
- said connecting means connects said electric cord to said conductor material.
5 more elements
A semiconductor device comprising:
- a substrate having a first surface and a second surface, and made of an electrode member with a majority of a total volume thereof being a conductor material;
- a semiconductor chip provided on the first surface of said substrate and having a plurality of electrode pads;
- a plurality of leads, each spaced apart from the first surface of said substrate;
- a plurality of connecting means for electrically connecting said leads and said substrate to corresponding ones of the electrode pads of said semiconductor chip;
- a resin package encapsulating said semiconductor chip, respective parts of said leads and said substrate, wherein a portion of the second surface of said substrate remains uncovered by said resin package;
- an electric cord having an end;
- and
- a screw connected to the end of said electric cord, wherein
- said substrate at the second surface has a screw hole which engages said screw connected to the end of said electric cord.
6 more elements
A semiconductor device comprising:
- a substrate having a first surface, a second surface opposite the first surface and a first conductor part extending from the first surface to the second surface, wherein a majority of a total volume of said substrate is formed of a conductor material;
- a semiconductor chip mounted on the first surface of said substrate and having a plurality of electrode pads;
- an external circuit substrate having a mounting surface and a plurality of conductor patterns formed on the mounting surface;
- a plurality of leads having respective first ends connected to the mounting surface of said external circuit substrate and having respective second ends, each of said plurality of leads spaced apart from the first surface of said substrate;
- first connecting wires electrically connecting the respective second ends of said plurality of leads to corresponding ones of the plurality of electrode pads;
- a second connecting wire electrically connecting the first conductor part to a corresponding one of the plurality of electrode pads;
- a resin package encapsulating said semiconductor chip, the first ends of said plurality of leads and said substrate, wherein at least a portion of the first conductor part is exposed at the second surface of said substrate;
- a plurality of second conductor parts comprising via conductors formed in said substrate, extending from the first surface to the second surface of said substrate, the second surface of said substrate being mounted on the mounting surface of said external circuit substrate, the plurality of second conductor parts and the first conductor part being free of said resin package at the second surface of said substrate and making contact with corresponding ones of the plurality of conductor patterns of said external circuit substrate;
- and
- third connecting wires electrically connecting the plurality of second conductor parts to corresponding ones of the plurality of electrode pads.
7 more elements
A semiconductor device comprising:
- a substrate having a first surface, a second surface opposite the first surface and a first conductor part extending from the first surface to the second surface, wherein a majority of a total volume of said substrate is formed of a conductor material;
- a semiconductor chip mounted on the first surface of said substrate and having a plurality of electrode pads;
- an external circuit substrate having a mounting surface and a plurality of conductor patterns formed on the mounting surface;
- a plurality of leads having respective first ends connected to the mounting surface of said external circuit substrate and having respective second ends, each of said plurality of leads spaced apart from the first surface of said substrate;
- first connecting wires electrically connecting the respective second ends of said plurality of leads to corresponding ones of the plurality of electrode pads;
- a second connecting wire electrically connecting the first conductor part to a corresponding one of the plurality of electrode pads;
- a resin package encapsulating said semiconductor chip, the first ends of said plurality of leads and said substrate, wherein at least a portion of the first conductor part is exposed at the-second surface of said substrate;
- a plurality of second conductor parts and insulator parts isolating each of the first conductor part and the plurality of second conductor parts, each of the first conductor part and the plurality of second conductor parts being electrode members extending from the first surface to the second surface;
- third connecting wires electrically connecting the plurality of second conductor parts to corresponding ones of the plurality of electrode pads;
- and
- an electric cord connected to the first conductor part and the plurality of second conductor parts at the second surface of said substrate, said electric cord extending to the mounting surface of said external circuit substrate.
8 more elements
A semiconductor device comprising:
- a substrate having a first surface and a second surface, and made of an electrode member with a majority of a total volume thereof being a conductor material;
- a semiconductor chip provided on the first surface of said substrate and having a plurality of electrode pads;
- a plurality of leads, each spaced apart from the first surface of said substrate;
- a plurality of connecting means for electrically connecting said leads and said substrate to corresponding ones of the electrode pads of said semiconductor chip;
- a resin package encapsulating said semiconductor chip, respective parts of said leads and said substrate, wherein a portion of the second surface of said substrate remains uncovered by said resin package;
- an electric cord having an end;
- and
- a screw connected to the end of said electric cord,
- wherein said conductor material is threaded to engage said screw connected to the end of said electric cord.
6 more elements
A semiconductor device comprising:
- a substrate having a first surface and a second surface, and made of an electrode member with a majority of a total volume thereof being a conductor material;
- a semiconductor chip provided on the first surface of said substrate and having a plurality of electrode pads;
- a plurality of leads, each spaced apart from the first surface of said substrate;
- a plurality of connecting means for electrically connecting said leads and said substrate to corresponding ones of the electrode pads of said semiconductor chip;
- a resin package encapsulating said semiconductor chip, respective parts of said leads and said substrate, wherein a portion of the second surface of said substrate remains uncovered by said resin package;
- an electric cord having an end;
- and
- a screw connected to the end of said electric cord and directly contacting said conducting material.
5 more elements
Dependencies are inferred from the claim text.