Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die

An integrated circuit package having a reversible pin-out arrangement, the integrated circuit package comprising:

• an integrated circuit die having a front-side surface with a plurality of bond pads thereon, having a first edge, and an opposing second edge, at least one bond pad of the plurality of bond pads located adjacent the first edge of the integrated circuit die and at least one bond pad of the plurality of bond pads located adjacent the opposing second edge of the integrated circuit die;
• a housing having a first side and an opposing second side;
• a Leads-Over-Chip (LOC) lead frame disposed within the housing and including a plurality of interdigitated leads, each lead of the plurality of interdigitated leads in first and second groups of leads extending substantially from respective said first edge and opposing second edge of the front-side surface, at least one lead of said first group of leads terminating prior to said at least one bond pad of the plurality of bonds pads located adjacent the opposing second edge of the integrated circuit die and at least one lead of said second group of leads terminating before said at least one bond pad of the plurality of bond pads located adjacent the first edge of the integrated circuit die, across the front-side surface, over the respective opposing second edge and first edge of the front-side surface, away from the integrated circuit die, and out the respective first and opposing second sides of the housing to terminate in a pin, each bond pad of the plurality of bond pads on the front-side surface being alternatively coupleable by an electrical connection extending over only the front-side surface to an adjacent lead of the first and second group of leads so each bond pad is alternatively accessible through pins of the respective first and opposing second sides of the housing;
• and
• a piece of tape overlying a portion of said front-side surface of said integrated circuit die, said piece of tape between said integrated circuit die and said LOC lead frame.

An integrated circuit package comprising:

• an integrated circuit die having a front-side surface having a plurality of bond pads thereon, having a first edge, an opposing second edge, at least one bond of the plurality of bond pads located on the front-side surface adjacent the first edge, and at least one bond pad of the plurality of bond pads located on the front-side surface adjacent the opposing second edge;
• tape for overlying the front-side surface of the integrated circuit die;
• and
• a Leads-Over-Chip (LOC) lead frame including a plurality of interdigitated leads for overlying the tape and the front-side surface of the integrated circuit die, a first portion of the plurality of interdigitated leads extending across the front-side surface from the first edge thereof substantially to the opposing second edge thereof terminating on the front-side surface of the integrated circuit die before the at least one bond pad of the plurality of bond pads located adjacent the first edge of the integrated circuit die and a second portion of the plurality of interdigitated leads extending across the front-side surface from the opposing second edge thereof substantially to the first edge thereof terminating on the front-side surface of the integrated circuit die before the at least one bond pad of the plurality located adjacent the opposing second edge, said first portion of the plurality of interdigitated leads being interdigitated with said second portion of leads and each bond pad on the front-side surface being alternatively coupleable via an electrical connection extending only over the front-side surface to adjacent leads of the first and second portions of the plurality of interdigitated leads.

An integrated circuit package having a reversible pin-out arrangement, the integrated circuit package comprising:

• a integrated circuit die having a front-side surface with a plurality of bond pads thereon and having a first edge and an opposing second edge, at least one bond pad of the plurality of bond pads on the front-side surface located adjacent the first edge and at least one bond pad of the plurality of bond pads on the front-side surface located adjacent the opposing second edge;
• tape overlying a portion of the front-side surface of the integrated circuit die;
• a housing having a first side and an opposing second side;
• a Leads-Over-Chip (LOC) lead frame supportable by the housing and including a plurality of interdigitated leads overlying the tape and portions of the front-side surface of the integrated circuit die, each lead in first and second groups of leads of the plurality of interdigitated leads extending substantially from respective first edge and opposing second edge of the front-side surface and having an end thereof terminating before said at least one bond pad of said plurality of bond pads located adjacent one of said first edge and said opposing second edge of said integrated circuit die, extending over the respective opposing second edge and first edge of the front-side surface of said integrated circuit die, extending away from the integrated circuit die, and extending out the respective first side and opposing second side of the housing to terminate in a pin, each bond pad of the plurality of bond pads on the front-side surface being alternately compellable to adjacent first and second group leads of the plurality of interdigitated leads so said each bond pad of the plurality of bond pads located on the front-side surface of the integrated circuit die is alternatively electrically connected via an electrical connection extending across only the front-side surface to the plurality of interdigitated leads extending across the front-side surface of the integrated circuit die and accessible through pins on the first and opposing second sides of the housing.