US 6,271,579 B1 · High-frequency passband microelectronics package

Abstract

A high-frequency passband microelectronic package suitable for housing a high-frequency (e.g.,GHz range) electronic device operating at frequencies within the passband is disclosed herein. The package includes a base, an RF circuit substrate attached to a surface of the base and having a cavity for receiving the electronic device, and transmission lines formed on a surface of the circuit substrate. Each transmission line includes a first conductive pad for attachment to a node of the electronic device, a second conductive pad for attachment by a conductive lead to a node external to the package, and a matching circuit electrically coupled between the pads. The matching circuit includes a non-straight conductive trace shaped to compensate for impedance discontinuities between the node of the electronic device and the node external to the package at the high-frequency passband. For example, the trace can be shaped to compensate for the impedance discontinuity caused by the lead. The shape of the trace is determined by an electromagnetic simulation computer program simulating the frequency response of the transmission line based upon predetermined parameters defining the electromagnetic environment in which the trace will be used, and iterating the shape of the trace until desired performance characteristics are met at a passband frequency range of interest. The transmission lines may include microstrip, co-planar waveguide, and stripline transmission lines. A mating transmission line having such a matching circuit can also be formed on a circuit board having such a high-frequency package mounted thereto.

Claims30

Dependent claims

A transmission line for use with a high-frequency passband microelectronics package, the package suitable for housing a high-frequency electronic device which operates at frequencies within the passband, the electronic device having at least one electrical node to be electrically coupled by the transmission line and a conductive lead to a corresponding electrical node external to the package, the transmission line comprising:

a first conductive pad for electrical attachment to the electrical node of the high-frequency electronic device housed within the package;
a second conductive pad for electrical attachment by the conductive lead to the electrical node external to the package;
and
a matching circuit electrically coupled between the first and second conductive pads, the matching circuit including a non-straight conductive trace shaped to compensate for at least one impedance discontinuity between the electrical node of the electronic device and the electrical node external to the package at the high-frequency passband of the package.

1 more element

A high-frequency passband microelectronics package suitable for housing a high-frequency electronic device which operates at frequencies within the passband, the electronic device having at least one electrical node to be electrically coupled by a conductive lead to a corresponding electrical node external to the package, comprising:

a base having a top surface and a bottom surface;
an RF circuit substrate attached to the top surface of the base, the RF circuit substrate having a surface and a cavity for receiving the high-frequency electronic device;
and
at least one transmission line formed on the surface of the RF circuit substrate, the transmission line including a first conductive pad for electrical attachment to the electrical node of the high-frequency electronic device, a second conductive pad for electrical attachment by the conductive lead to the electrical node external to the package, and a matching circuit electrically coupled between the first and second conductive pads, the matching circuit including a non-straight conductive trace shaped to compensate for at least one impedance discontinuity between the electrical node of the electronic device and the electrical node external to the package at the high-frequency passband of the package.

1 more element

A circuit board for mounting at least one high-frequency microelectronics package which operates at frequencies within a passband, the package having at least one electrical node to be electrically coupled by a conductive lead to a corresponding electrical node external to the package, comprising:

a lower circuit board layer having a top surface and a bottom surface;
a circuit board substrate layer attached to the top surface of the lower circuit board layer, the circuit board substrate layer having a surface for receiving the high-frequency microelectronics package;
at least one transmission line formed on the surface of the circuit board substrate layer, the transmission line including a first conductive pad for electrical attachment by the conductive lead to the electrical node of the high-frequency package, a second conductive pad for electrical attachment to the electrical node external to the package, and a matching circuit electrically coupled between the first and second conductive pads, the matching circuit including a non-straight conductive trace shaped to compensate for at least one impedance discontinuity between the electrical node of the package and the electrical node external to the package at the high-frequency passband of the package.

Dependencies are inferred from the claim text.

High-frequency passband microelectronics package

Life of this patent

High-frequency passband microelectronics package

Life of this patent

Abstract

Claims30