US 6,271,531 B1Granted

Charged beam drawing apparatus and method thereof

AssigneeNEC Corporation

InventorToshiya Yamaguchi

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Abstract

A wafer with a surface on which a to-be-exposed resist is applied is first placed in a predetermined position. The position of the wafer and an irradiation position of en electron beam to be irradiated for exposing the resist are both aligned. Next, a chip area is exposed by irradiating the electron beam onto the chip area of the wafer in which to-be-manufactured chips are formed. Now, a peripheral area, which is positioned at the periphery of the chip area and in which incomplete chips not to be manufactured are formed, is exposed with the electron beam while setting accuracy of the irradiation position of the electron beam and an exposure amount thereof lower and smaller than accuracy of the irradiation position and an exposure amount thereof when exposing the chip area. After the exposure, the wafer onto which the electron beam has been irradiated is removed from the predetermined position.

Claims20

Dependent claims

A charged beam drawing apparatus comprising:

a particle source which outputs a charged beam to be irradiated onto a wafer having a surface on which a to-be-exposed resist is applied;
predetermined number of masks each of which has an aperture through which the charged beam can pass;
at least one lens which changes a forward direction of the charged beam and changes a degree of convergence of the charged beam;
and
a controller which irradiates the charged beam onto the wafer with predetermined accuracy of an irradiation position and at a predetermined exposure amount, by controlling at least either of said particle source, said masks, or of said lens, and
wherein said controller irradiates the charged beam onto a peripheral area of the wafer while setting the accuracy of the irradiation position of the charged beam lower when exposing the peripheral area, which is positioned at periphery of a chip area including to-be-manufactured device chips and in which incomplete peripheral chips not to be manufactured are formed, than the accuracy of the irradiation position of the charged beam when exposing the chip area of the wafer.

3 more elements

Dependencies are inferred from the claim text.