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US 6,271,481 B1Granted
Pad configurations for improved etching of multilayer circuit assemblies
AssigneeVisteon Global Technologies, Inc.
InventorsLakhi Nandlal Goenka, Jay DeAvis Baker
Life of this patent
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Abstract
There is disclosed herein a tri-metal-layer precircuit 50 which may be selectively etched to provide a multilayer electronic circuit 60 having air bridge crossovers 49. The enlarged ends 44 of the upper air bridge elements 42, and/or the top pads 41 of the tower elements 43, are specially designed such that undercutting of the ends 44 and/or top pads 41 is minimized, thereby minimizing the risk of air bridge/top pad delamination.
Claims23
A tri-metal-layer precircuit for use in making a multilayer electronic circuit, comprising:
- (a) a metallic foil made of a first metal and having a top surface and a bottom surface;
- (b) a first conductor pattern attached to said bottom surface of said metallic foil and being made of a second metal, wherein said first conductor pattern includes a plurality of base pads, pedestal pads, and circuit traces;
- and
- (c) a second conductor pattern attached to said top surface of said metallic foil and being made of a third metal, wherein said second conductor pattern includes
- (i) a plurality of top pads each arranged opposite a respective one of said base pads, and
- (ii) a plurality of bridging elements having first and second enlarged ends and a constricted portion between and contiguous with said enlarged ends, wherein said bridging elements are arranged such that each enlarged end is disposed opposite a respective one of said pedestal pads and each constricted portion is disposed opposite and transverse to a respective one of said circuit traces,
- (d) wherein each of said top pads or said enlarged ends is generally shaped as an n-sided polygon, wherein n≧5.
4 more elements
A tri-metal-layer precircuit for use in making a multilayer electronic circuit, comprising:
- (a) a metallic foil made of a first metal and having a top surface and a bottom surface;
- (b) a first conductor pattern attached to said bottom surface of said metallic foil and being made of a second metal, wherein said first conductor pattern includes a plurality of base pads, pedestal pads, and circuit traces;
- and
- (c) a second conductor pattern attached to said top surface of said metallic foil and being made of a third metal, wherein said second conductor pattern includes
- (i) a plurality of top pads each arranged opposite a respective one of said base pads, and
- (ii) a plurality of bridging elements having first and second enlarged ends and a constricted portion between and contiguous with said enlarged ends, wherein said bridging elements are arranged such that each enlarged end is disposed opposite a respective one of said pedestal pads and each constricted portion is disposed opposite and transverse to a respective one of said circuit traces,
- (d) wherein each of said top pads or said enlarged ends is generally shaped as an n-sided polygon, wherein n≧6 and wherein said n-sided polygon is generally cross-shaped, asterisk-shaped, star-shaped, or truncated-star-shaped.
4 more elements
A tri-metal-layer precircuit for use in making a multilayer electronic circuit, comprising:
- (a) a metallic foil made of a first metal and having a top surface and a bottom surface;
- (b) a first conductor pattern attached to said bottom surface of said metallic foil and being made of a second metal, wherein said first conductor pattern includes a plurality of base pads, pedestal pads, and circuit traces;
- and
- (c) a second conductor pattern attached to said top surface of said metallic foil and being made of a third metal, wherein said second conductor pattern includes
- (i) a plurality of top pads each arranged opposite a respective one of said base pads, and
- (ii) a plurality of bridging elements having first and second enlarged ends and a constricted portion between and contiguous with said enlarged ends, wherein said bridging elements are arranged such that each enlarged end is disposed opposite a respective one of said pedestal pads and each constricted portion is disposed opposite and transverse to a respective one of said circuit traces,
- (d) wherein each of said top pads or said enlarged ends has a generally round or polygonal outer periphery thereabout with a plurality of notches extending inward from each outer periphery.
4 more elements
A multilayer electronic circuit made of first, second, and third metals, comprising:
- (a) a substrate having an electrically insulative surface;
- (b) a first conductor pattern attached to said electrically insulative surface, said first conductor pattern being made of said second metal and comprising a plurality of base pads, pedestal pads, and circuit traces;
- (c) a plurality of pedestals made of said first metal, wherein a respective one of said plurality of pedestals is disposed atop each base pad and pedestal pad;
- and
- (d) a second conductor pattern made of said third metal and comprising
- (i) a plurality of top pads each attached to a respective one of said pedestals atop a respective one of said base pads, and
- (ii) a plurality of bridging elements having first and second enlarged ends and a constricted portion between and contiguous with said enlarged ends, wherein said bridging elements are arranged such that each enlarged end is disposed atop a respective one of said pedestals atop a respective one of said pedestal pads, and wherein each constricted portion is disposed transverse to and spaced apart from a respective one of said circuit traces,
- (e) wherein each of said top pads or said enlarged ends is generally shaped as an n-sided polygon, wherein n≧5.
5 more elements
A multilayer electronic circuit made of first, second, and third metals, comprising:
- (a) a substrate having an electrically insulative surface;
- (b) a first conductor pattern attached to said electrically insulative surface, said first conductor pattern being made of said second metal and comprising a plurality of base pads, pedestal pads, and circuit traces;
- (c) a plurality of pedestals made of said first metal, wherein a respective one of said plurality of pedestals is disposed atop each base pad and pedestal pad;
- and
- (d) a second conductor pattern made of said third metal and comprising
- (i) a plurality of top pads each attached to a respective one of said pedestals atop a respective one of said base pads, and
- (ii) a plurality of bridging elements having first and second enlarged ends and a constricted portion between and contiguous with said enlarged ends, wherein said bridging elements are arranged such that each enlarged end is disposed atop a respective one of said pedestals atop a respective one of said pedestal pads, and wherein each constricted portion is disposed transverse to and spaced apart from a respective one of said circuit traces,
- (e) wherein each of said top pads or said enlarged ends is generally shaped as an n-sided polygon, wherein n≧6 and wherein said n-sided polygon is generally cross-shaped, asterisk-shaped, star-shaped, or truncated-star-shaped.
5 more elements
A multilayer electronic circuit made of first, second, and third metals, comprising:
- (a) a substrate having an electrically insulative surface;
- (b) a first conductor pattern attached to said electrically insulative surface, said first conductor pattern being made of said second metal and comprising a plurality of base pads, pedestal pads, and circuit traces;
- (c) a plurality of pedestals made of said first metal, wherein a respective one of said plurality of pedestals is disposed atop each base pad and pedestal pad;
- and
- (d) a second conductor pattern made of said third metal and comprising
- (i) a plurality of top pads each attached to a respective one of said pedestals atop a respective one of said base pads, and
- (ii) a plurality of bridging elements having first and second enlarged ends and a constricted portion between and contiguous with said enlarged ends, wherein said bridging elements are arranged such that each enlarged end is disposed atop a respective one of said pedestals atop a respective one of said pedestal pads, and wherein each constricted portion is disposed transverse to and spaced apart from a respective one of said circuit traces,
- (e) wherein each of said top pads or said enlarged ends has a generally round or polygonal outer periphery thereabout with a plurality of notches extending inward from each outer periphery.
5 more elements
Dependencies are inferred from the claim text.