Back to results
US 6,271,465 B1Granted
Low cost conformal EMI/RFI shield
AssigneeNokia Mobile Phones Ltd.
InventorSimon Lacey
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeNokia Mobile Phones Ltd.
InventorSimon Lacey
Estimating the term…
An EMI/RFI shield includes a shell made from a metalized polymeric material with a shape that is predetermined to form within at least one shielded cavity. The shell has sidewalls that terminate in a flange extending at an angle to the sidewalls. The flange has a lower surface for electrically coupling the shell to a predetermined electrical potential and an upper surface for engaging a structure, preferably a protruding rib from a cover, that exerts a compressive force on the top surface for urging the lower surface into an electrical coupling arrangement with an underlying planar conductor carrying the predetermined electrical potential (e.g., ground). The lower surface can include or be placed upon a layer of electrically conductive compliant material, such as a conductive adhesive. At least one of the sidewalls can include a projecting fluted structure having a size and location that is predetermined to engage a side of the structure that exerts the compressive force.
An electrical shield, comprising a shell comprised of a metalized polymeric material having a shape that is predetermined to form within at least one shielded cavity, said shell comprising sidewalls that terminate in a flange extending at an angle to said sidewalls, said flange having a lower surface for electrically coupling said shell to a predetermined electrical potential and an upper surface for engaging a structure that exerts a compressive force on said top surface for urging said lower surface into an electrical coupling arrangement with an underlying planar conductor carrying the predetermined electrical potential.
A cover for use with an electronic device comprising a circuit board containing components, said cover comprising on an inner surface thereof at least one rib structure protruding from said inner surface, said rib structure being located so as to at least partially surround a portion of said components, said rib structure having a length selected for engaging a flange that extends outwardly from sloping sidewalls of a compliant electrically conductive shield structure that forms a shielded cavity for containing said portion of said components, said rib structure having said length preselected for exerting and maintaining a compressive force on said flange when placed into an intended mechanical engagement with a remainder of said electronic device, said compressive force urging said flange against a planar conductor electrical coupling said shield structure to said conductor.
A method for assembling an electrical shield structure over circuitry to be shielded, comprising steps of:
Dependencies are inferred from the claim text.