Method for making a micromachine
AssigneeBall Semiconductor, Inc.
InventorRisaku Toda
Life of this patent
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Abstract
A method for making a micromachine, which includes a spherical body and a spherical shell surrounding said spherical body, comprising forming a victim layer on said spherical body to coat said spherical body, forming a function layer on said victim layer, said function layer including at least one conductive material pattern and/or insulating material layer, forming a structure layer of insulating material to coat said spherical body on which said function layer is formed, forming etching bores extending from the outer surface of said structure layer to said victim layer, and introducing gaseous etchant into said etching bores to remove said victim layer.
Claims9
A method for making a micromachine, which includes a spherical body and a spherical shell surrounding said spherical body, comprising;
- forming a victim layer on said spherical body to coat said spherical body,
- forming a function layer on said victim layer, said function layer including at least one conductive material pattern and/or insulating material layer,
- forming a structure layer of insulating material to coat said spherical body on which said function layer is formed,
- forming etching bores extending from the outer surface of said structure layer to said victim layer,
- introducing gaseous etchant into said etching bores to remove said victim layer.
A method for making a spherical body type sensor apparatus, which includes a spherical body and a spherical shell surrounding said spherical body comprising;
- forming a victim layer on a spherical body to coat said spherical body,
- forming electrode patterns of a conductive material on said victim layer,
- forming an insulating material layer to coat said electrode patterns,
- forming bores on said insulating material layer to expose said electrode patterns,
- forming circuit patterns on said insulating material layer to connect with said electrode patterns exposed from said insulating material layer,
- forming an insulating structure layer to coat said spherical body on which said circuit patterns have been formed,
- forming a plurality of etching bores extending from the outer surface of said structure layer to said victim layer, introducing gaseous etchant into said etching bores to remove said victim layer.
Dependencies are inferred from the claim text.