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US 6,271,111 B1Granted
High density pluggable connector array and process thereof
AssigneeInternational Business Machines Corporation
InventorsShaji Farooq, Suryanarayana Kaja, Li Wang
Life of this patent
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Abstract
The present invention relates generally to high density pluggable connector array and process thereof. More particularly, the invention encompasses a structure comprising high density pluggable connector arrays. A process for making such types of high density pluggable connector arrays is also disclosed.
Claims8
A process for forming a multi-layered interconnect structure comprising the steps of:
- (a) depositing at least one layer of nickel on a core and completely enveloping said core,
- (b) depositing at least one layer of gold over said layer of nickel and completely enveloping said layer of nickel,
- (c) depositing at least one layer of cobalt over said layer of gold and completely enveloping said layer of gold,
- (d) depositing at least one layer of copper over said layer of cobalt and completely enveloping said layer of cobalt, and then removing portions of said at least one layer of copper and said at least one layer of cobalt, thereby providing said multi-layered interconnect structure.
1 more element
Dependencies are inferred from the claim text.