Bump-forming method using two plates and electronic device
AssigneeFujitsu Limited
InventorsIchiro Yamaguchi, Koki Otake, Masahiro Yoshikawa
Life of this patent
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Abstract
First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.
Claims8
A method of forming bumps comprising the steps of:
- filling a plurality of cavities of a first plate with metal paste by squeegeeing, and filling a plurality of cavities of a second plate arranged in a mirror symmetry relationship with said cavities of said first plate with metal paste by squeegeeing;
- setting said first plate and said second plate in a facing relationship with each other with said cavities of said first plate located in registry with said cavities of said second plate;
- heating said first and second plates to form metal balls in said cavities in one of said first and second plates;
- moving one of said first and second plates relative to the other of said first and second plates, and
- transferring the metal balls in said cavities in one of said first and second plates to a device on which bumps are to be formed.
A method of forming bumps comprising the steps of:
- disposing a metal core in cavities of a first plate;
- filling a plurality of cavities of a second plate arranged in a mirror symmetry relationship with said cavities of said first plate with metal paste which has a lower melting point than the metal core;
- setting said first plate and said second plate transferring the metal balls in said cavities in one of said first and second plates to a device on which bumps are to be formed in afacing relationship with each other so as to locate said cavities of said first plate on said cavities of said second plate;
- and
- heating said first and second plates to form metal balls having the metal core in the metal balls in said cavities in one of said first and second plates.
Dependencies are inferred from the claim text.