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US 6,271,058 B1Granted
Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board
AssigneeNEC Corporation
InventorYuichi Yoshida
Life of this patent
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Abstract
There is provided a method of manufacturing a semiconductor device that ensures the connection state and enhance structural stability, reliability and heat-radiation performance. In a first step, metal bumps are joined to one of electrodes on a semiconductor chip and connection pads on a board. In a second step, the semiconductor chip is adhered to join means. In a third step, join means is joined with the board for connecting the metal bumps with the electrodes or the connection pads.
Claims8
A method of manufacturing a semiconductor device in which a semiconductor chip is mounted facedown on a board, comprising the steps of:
- joining metal bumps to one of electrodes on said semiconductor chip and connection pads on said board;
- adhering said semiconductor chip to join means;
- and
- joining said join means with said board for contacting said metal bumps with said electrodes or said connection pads.
1 more element
Dependencies are inferred from the claim text.