Method of making semiconductor chip package

A method of making a semiconductor chip package comprising the steps of:

• providing a flexible film carrier having opposing upper and lower surfaces, the upper surface of the flexible film carrier having a die receiving area;
• forming a plurality of through-holes in the flexible film carrier, the through-holes being disposed around the die receiving area;
• laminating a metal layer on the lower surface of the flexible film carrier;
• etching the metal layer to form a plurality of connection pads having opposing front and backside surfaces, the front surface of each connection pad has a portion exposed within the corresponding through-hole;
• forming a metal coating on the surfaces of the connection pads which are not covered by the flexible film carrier;
• attaching a semiconductor chip to the die receiving area of the flexible film carrier, the semiconductor chip having a plurality of bonding pads;
• electrically coupling the bonding pads of the semiconductor chip to the front surfaces of the connection pads;
• forming a package body over the upper surface of the flexible film carrier and the semiconductor chip.