Stacked semiconductor package and method of fabrication

A method for fabricating a semiconductor package comprising:

• providing a first substrate on a first panel having a first planar surface, the first panel comprising a plurality of first substrates;
• providing a second substrate on a second panel having a second planar surface, the second panel comprising a plurality of second substrates;
• the first substrate and the second substrate each comprising a first side, a plurality of first contacts on the first side in a pattern, an opposing second side, a plurality of second contacts on the second side in the pattern, and a plurality of interlevel conductors electrically connecting the first contacts and the second contacts;
• wire bonding a first semiconductor die to the first substrate in electrical communication with the first contacts and the second contacts thereon such that the first planar surface remains planar;
• wire bonding a second semiconductor die to the second substrate in electrical communication with the first contacts and the second contacts thereon such that the second planar surface remains planar;
• stacking the first panel to the second panel with the first planar surface on the second planar surface and the first substrate on the second substrate;
• following the stacking step, bonding the first contacts on the first substrate to the second contacts on the second substrate;
• and
• following the bonding step, separating the first substrate and the second substrate in a stack from the first panel and the second panel.

A method for fabricating a semiconductor package comprising:

• providing a first panel comprising a plurality of substrates, each substrate comprising a first side with a plurality of first contacts thereon, an opposing second side with a plurality of second contacts thereon, and a plurality of interlevel conductors electrically connecting the first contacts and the second contacts;
• providing a second panel substantially identical to the first panel;
• mounting a plurality of dice to the substrates in electrical communication with the first contacts and the second contacts thereon, the dice mounted to the substrates such that each panel has a planar first surface and a planar second surface;
• stacking the second panel to the first panel with the planar first surface on the first panel proximate to the planar second surface on the second panel;
• following the stacking step, bonding the second contacts on the second panel to the first contacts on the first panel;
• and
• following the bonding step, separating the substrates from the first panel and from the second panel.

A method for fabricating a semiconductor package comprising:

• providing a substrate on a first panel containing a plurality of identical substrates, the substrate comprising a first side, an opposing second side, a first cavity in the first side, a second cavity in the second side, a plurality of first pads in the first cavity, a plurality of first contacts on the first side in electrical communication with the first pads, a plurality of second contacts on the second side having a same pattern as the first contacts, an opening between the first cavity and the second cavity and a plurality of interlevel conductors electrically connecting the first contacts to the second contacts;
• mounting a die comprising a plurality of second pads to the second cavity with the second pads aligned with the opening and with the second side generally planar;
• wire bonding a plurality of wires in the opening to the first pads and to the second pads and with the first side generally planar;
• providing a second substrate substantially identical to the substrate on a second panel containing a plurality of identical second substrates, the second substrate having a second die mounted and wire bonded thereto;
• stacking the first panel on the second panel to form a stack with the second side of the substrate on the first side of the second substrate;
• following the stacking step, bonding the second contacts on the substrate to the first contacts on the second substrate;
• and
• following the bonding step separating the substrate and the second substrate from the stack.