Method for producing an optoelectronic component
AssigneeSiemens Aktiengesellschaft
InventorsFranz Auracher, Wolfgang Gramann
Life of this patent
Estimating the term…
Abstract
In a method for producing an optoelectronic component, a laser chip is secured to a semiconductor wafer that is provided with metal structures. Thereafter, for each laser chip, one lens-coupling optical element that deflects the beam path of the laser chip is positioned on the semiconductor wafer. The laser chip is driven, and the space between the laser chip and the lens-coupling optical element is varied and set such that a predetermined beam condition with respect to the location of the optical image plane is met.
Claims13
A method of producing an optoelectronic component with a light-emitting laser chip and a lens-coupling optical element for a defined projection of an optical beam generated by the laser chip, the method which comprises:
- providing a semiconductor wafer with a metal structure;
- electrically contacting and mechanically securing a laser chip to the metal structure and orienting the laser chip with a beam path substantially parallel to the semiconductor wafer;
- positioning a lens-coupling optical element on the semiconductor wafer for deflecting the beam path of the laser chip;
- driving the laser chip;
- varying a spacing between the laser chip and the lens-coupling optical element and setting the spacing such that a deflected laser light leaving the lens-coupling optical element meets a predetermined beam condition with regard to a location of an optical image plane;
- and
- securing the lens-coupling optical element in the set position to the semiconductor wafer.
Dependencies are inferred from the claim text.