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AssigneeUnisys Corporation
InventorsKenneth Patrick Reilich, Ronald Allen Norell, Elvira Widyani Preecha, Joel Elwood Wing, Lorraine Lo-Lan Wing
Estimating the term…
An integrated circuit package is processed by a grinding step, a dissolving step, and a disintegrating step. The grinding step grinds an IC-chip completely off of a substrate, and it also grinds a first portion of a filler layer and a first portion of a set of solder balls which attach the IC-chip to the substrate. This leaves a partial filler layer and partial solder balls on the substrate. The dissolving step dissolves the partial filler layer off of the substrate after the grinding step; and the disintegration step disintegrates at least part of each partial solder ball by subjecting the partial solder balls on the substrate to ultrasonic vibration after the dissolving step. These steps leave the substrate with small solder mounds that can be easily attached to another IC-chip with another set of solder balls.
A process for recycling a substrate from an IC-package of the type in which—a) said substrate has a face with a plurality of I/O pads, b) an IC-chip is spaced-apart from said face and has a plurality of I/O pads that are aligned with said I/O pads on said substrate, c) respective solder balls connect said I/O pads on said substrate to said I/O pads on said IC-chip, and d) a filler layer fills the space between said substrate and said IC-chip and said solder balls;
A process for recycling a substrate from an IC-package of the type in which —a) said substrate has a face with a plurality of I/O pads, and b) respective partial solder balls are attached to said I/O pads on said substrate;
Dependencies are inferred from the claim text.