Tool tip and bonding tool comprising the tool tip and control method for the bonding tool
AssigneeSumitomo Electric Industries, Ltd.
InventorsKatsuko Yamamoto, Takahisa Iguchi, Yoshiaki Kumazawa, Katsuyuki Tanaka, Hiromu Shiomi, Takashi Tsuno, Naoji Fujimori
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Abstract
A conductive polycrystalline diamond film having specific resistance of at least 1×10−4 Ωcm and less than 1×103 Ωcm, whose film thickness is in the range of at least 0.1 μm and not more than 500 μm, is film-formed by vapor-phase synthesis on a surface employed for pressure bonding, a surface opposite to this surface or at least two side surfaces intersecting with these surfaces on a substrate of a bonding tool tip that is applicable for bonding and packaging a semiconductor chip.
Claims24
A bonding tool for bonding conductors onto a semiconductor chip, comprising a tool body having a forward end and a tool tip mounted on said forward end of said tool body;
- wherein said tool tip comprises:
- a substrate that is mainly composed of at least one material selected from the group consisting of polycrystalline diamond, Si, SiC, AlN, Si3N4, and single-crystalline diamond, and that has a mounting surface facing toward and mounted at least indirectly on said forward end of said tool body, a bonding surface facing opposite said mounting surface and adapted at least indirectly to carry out said bonding, and at least two side surfaces intersecting with said mounting surface and said bonding surface;
- a vapor-synthesized conductive polycrystalline diamond film that is provided on said bonding surface, said mounting surface, or said at least two side surfaces of said substrate, and that has a specific resistance of at least 1×10−4 Ωcm and less than 1×103 Ωcm and a film thickness of at least 0.1 μm and not more than 500 μm;
- and
- a metal film that is provided contacting at least a portion of said conductive polycrystalline diamond film, and that is adapted to introduce electrical power into said conductive polycrystalline diamond film.
A bonding tool for bonding conductors onto a semiconductor chip, comprising a feed holder having a forward end and a tool tip mounted on said forward end of said feed holder;
- wherein said tool tip comprises:
- a substrate that is mainly composed of at least one material selected from the group consisting of polycrystalline diamond, Si, SiC, AlN, Si3N4, and single-crystalline diamond, and that has a mounting surface facing toward and mounted at least indirectly on said forward end of said feed holder, a bonding surface facing opposite said mounting surface and adapted at least indirectly to carry out said bonding, and at least two side surfaces intersecting with said mounting surface and said bonding surface;
- a vapor-synthesized conductive polycrystalline diamond film that is provided on said bonding surface, said mounting surface, or said at least two side surfaces of said substrate;
- and
- a metal film that is provided contacting at least a portion of said conductive polycrystalline diamond film, and that is adapted to introduce electrical power into said conductive polycrystalline diamond film;
- and
- wherein said feed holder comprises:
- at least one metal electrode that contacts said metal film and is adapted to supply electrical power to said tool tip;
- and
- a ceramic base that supports said metal electrode.
A method of operating a bonding tool having a tool tip including a conductive polycrystalline diamond film, comprising the following steps:
- a) providing electrical power to said conductive polycrystalline diamond film so as to heat said diamond film;
- b) during said step a), measuring an electrical resistance of said diamond film so as to determine a change of said electrical resistance;
- and
- c) responsive to and dependent on said change of said electrical resistance, adjusting said providing of said electrical power so as to control a temperature of said diamond film;
- and
- d) pressing said tool tip against conductors so as to bond said conductors onto a semiconductor chip.
Dependencies are inferred from the claim text.