Molding die and marking method for semiconductor devices

A method for simultaneously molding and marking semiconductor device containing packages, said method comprising the steps of:

• (i) providing a multi-part molding die defining a closable cavity for simultaneously sealingly molding a semiconductor element in a package of a preselected size and shape and creating a marking having a predetermined content on a surface of the package, said molding die comprising:
• at least two integrally formed members, each said member defining inner walls forming an open-topped cavity portion of said closable cavity, and said closable cavity being sized to accommodate the semiconductor element within said preselected shaped package and adapted to receive a quantity of synthetic resin encapsulating the semiconductor element;
• a mask including means for forming a distinctive pattern representative of said content of said marking to be created on said surface of said package;
• and a single-piece jig adapted for releaseably holding said mask;
• wherein one of said members and said jig are adapted to mechanically interact directly with one another so as to removably retain said jig immediately outwardly adjacent to portions of said preselected package shape defined by said one of said members while said jig releaseably holds said mask at a predetermined position immediately inwardly adjacent to the preselected package shape defined by said one of said members;
• (ii) locating said mask in said jig and locating said mask containing jig in one of said members in said predetermined position;
• (iii) closing said mold cavity;
• and
• (iv) filling said closed mold cavity with a synthetic resin so as to form a molded package encapsulating said semiconductor element and create said marking on a surface of said package in accordance with said predetermined content of said marking representatively defined by said mask.

A method for simultaneously molding and marking semiconductor device containing packages, said method comprising the steps of:

• (i) providing a multi-part molding die defining a closable cavity for simultaneously sealingly molding a semiconductor element in a package having a preselected shape and creating a marking having a predetermined content on a surface of the package, said molding die comprising:
• at least two integrally formed members, each said member defining inner walls forming an open-topped cavity portion of said closable cavity, and said closable cavity being sized to accommodate the semiconductor element within said preselected shaped package and adapted to receive a quantity of synthetic resin encapsulating the semiconductor element;
• a mask including a distinctive pattern representative of said content of said marking to be created on said surface of said package;
• wherein said one of said members and said mask are adapted to mechanically interact directly with one another so as to removably retain said mask at a predetermined position immediately inwardly adjacent to the portion of the predetermined package shape defined by said one of said members;
• (ii) locating said mask in said molding die in said predetermined position;
• (iii) closing said mold cavity;
• and
• (iv) filling said closed mold cavity with a synthetic resin so as to form a molded package encapsulating said semiconductor element and create said marking on a surface of said package in accordance with said predetermined content of said marking representatively defined by said mask.

A method for simultaneously molding and marking semiconductor device containing packages, said method comprising the steps of:

• (i) providing a multi-part molding die defining a closable cavity for simultaneously sealingly molding a semiconductor element in a package and creating a marking having a predetermined content on a surface of the package, said molding die comprising at least two integrally formed members, each said member defining inner walls forming an open-topped cavity portion of said closable cavity and at least one of said members including at least a section adapted to directly receive and releaseably hold a pigment containing material in a pattern representative of said predetermined content, and said closable cavity being sized to accommodate the semiconductor element to be packaged and adapted to receive a quantity of synthetic resin encapsulating the semiconductor element;
• (ii) directly applying said pigment containing material to said at least a section in a pattern representative of said predetermined content;
• (iii) closing said mold cavity;
• and
• (iv) filling said closed mold cavity with a synthetic resin so as to form a molded package encapsulating said semiconductor element and to transfer said pigment containing material into a surface of said package in accordance with said predetermined content of said marking.

A method for simultaneously molding and marking semiconductor device containing packages, said method comprising the steps of:

• (i) providing a multi-part molding die defining a closable cavity for simultaneously sealingly molding a semiconductor element in a package of a preselected shape and creating a marking having a predetermined content on a surface of the package, said molding die comprising:
• at least two integrally formed members, each said member defining inner walls forming an open-topped cavity portion of said closable cavity and at least one of said members including a pattern defining element directly mechanically associated with at least an inwardly facing section of said preselected shape defined thereby, said pattern defining element being adapted to removably receive and carry a pattern representative of said predetermined content, and said closable cavity being sized to accommodate the semiconductor element within said preselected shaped package and adapted to receive a quantity of synthetic resin encapsulating the semiconductor element;
• (ii) directly mechanically associating said pattern defining element with said at least a section of said at least one of said members;
• (iii) closing said mold cavity;
• and
• (iv) filling said closed mold cavity with a synthetic resin so as to form a molded package encapsulating said semiconductor element and to transfer said marking content into a surface of said package.