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AssigneeInternational Business Machines Corporation
InventorsErick Gregory Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni, Daniel Charles Edelstein, James E. Fluegel, Josef Warren Korejwa, Peter S. Locke, Cyprian Emeka Uzoh
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A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.
A plating apparatus using a plating solution and an electrical plating current for plating metal on a surface of a substrate, the apparatus comprising:
A method of plating metal on a surface of a substrate, the plating being performed using a plating solution and an electrical plating current, the method comprising the steps of:
Dependencies are inferred from the claim text.