US 6,270,645 B1Granted

Simplified process for production of roughened copper foil

AssigneeCircuit Foil USA, Inc.

InventorsCharles B. Yates, Adam Wolski, George Gaskill, Chinsai T. Cheng, Keith Bodendorf, Paul Dufresne

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Abstract

A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft2, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred to a station for applying the treatment directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled.

Claims9

Dependent claims

A process for the production of electrodeposited copper foil having an electrodeposited copper bonding treatment on a surface of the foil for enhancing the bondability of the foil to a polymeric substrate, which comprises:

(a) passing a web of raw electrodeposited copper foil directly from a rotating drum cathode machine to a treater tank containing an anode immersed in a copper sulfate-sulfuric acid electrolyte;
(b) passing the copper foil through the electrolyte while passing an electric current from a direct current power source to the anode and through the electrolyte to the copper foil to electrodeposit a single micro-roughening copper treatment layer on at least one surface of the copper foil, the treatment layer being electrodeposited under electrodeposition conditions which include a current density of from about 40 to about 100 A/ft2 and a plating time of greater than 30 sec.

Dependencies are inferred from the claim text.