Process of forming electrode of chip electronic part

A process for forming a plurality of electrodes on a chip electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip electronic part, the process comprising the steps of:

• applying a set of first bands of conductive material to at least one of the side surfaces, each of the first bands being applied at a different axial position on the side surfaces so as to be spaced from one another;
• and
• applying a set of second bands of conductive material to the remaining side surface(s), each of the second bands being applied at a different axial position of the remaining side surfaces so as to be spaced from one another, each band of the first set meeting a respective band of the second set at two respective edges such that each respective pair of bands forms a continuous band of conductive material extending around the outer periphery of the chip electronic part.

A process for forming an electrode on each of a plurality of chip electronic parts of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally perpendicular to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip electronic part, the process comprising the steps of:

• applying a first band of conductive material to at least one of the side surfaces of each of the chip electronic parts;
• and
• simultaneously applying a second band of conductive material to the remaining side surface(s) of each of the chip electronic parts in such a manner that the first and second bands of a respective chip electronic part meet at respective ones of the edges on that chip electronic part and together form a continuous band of conductive material extending around the outer periphery of that chip electronic part.