Method for producing filled vias in electronic components
AssigneeCoorsTek, Inc.
InventorsMarcus A. Ritland, Steven M. Landin
Life of this patent
Estimating the term…
Abstract
The present invention relates to a process for producing filled vias which are made of two components, a first component which forms a bonding layer between the wall of the via and a second component which forms the core of the via. Preferably, the two components solidify from a melt which includes two immiscible liquids. The first liquid is capable of wetting the wall of the via and the second liquid. The resulting product is also disclosed. Preferably the first component comprises a copper oxide and the second component comprises a conductive metal such as silver or copper.
Claims20
A process for producing a product, said process comprising:
- a) providing a substrate having at least one hole passing through said substrate, wherein said substrate comprises a sintered ceramic material;
- b) inserting a material into said hole;
- and
- c) firing the assembly in order to form a two liquid system, wherein a first liquid wets both said substrate and a second liquid and said first liquid migrates to a boundary area within said hole between said substrate and said second liquid and upon solidification said first liquid forms a first component and said second liquid forms a second component, wherein said first component forms an effective bond with said substrate and wherein said second component effectively bonds to said first component.
Dependencies are inferred from the claim text.