Polishing apparatus and method with constant polishing pressure
AssigneesNEC Corporation, Niken Corporation
InventorsYoshihiro Hayashi, Takahiro Onodera, Yamato Samitsu, Kiyoshi Tanaka, Naoki Sasaki
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Abstract
In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.
Claims21
An apparatus for polishing a substrate, comprising:
- a polishing platen for mounting said substrate;
- a polishing head;
- a polishing pad adhered to a bottom face of said polishing head;
- a rocking section, connected to said polishing head, for rocking said polishing head with respect to said polishing platen;
- and
- a control circuit, connected to said polishing head and said rocking section, for controlling a load of said polishing pad applied to said substrate in accordance with a contact area of said polishing pad to said substrate.
A method for polishing a substrate in a polishing apparatus including:
- a polishing platen for mounting said substrate;
- a polishing head;
- a polishing pad adhered to a bottom face of said polishing head;
- and a rocking section, connected to said polishing head, for rocking said polishing head with respect to said polishing platen, comprising the steps of:
- calculating a contact area of said polishing pad to said substrate;
- calculating a load of said polishing pad by multiplying the contact area of said polishing pad to said substrate a constant polishing pressure value;
- and
- controlling a load of said polishing pad in accordance with the calculated load of said polishing pad.
Dependencies are inferred from the claim text.