IC socket
AssigneeTokyo Eletech Corporation
InventorsMasayoshi Hoshino, Masakazu Yayoshi
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AssigneeTokyo Eletech Corporation
InventorsMasayoshi Hoshino, Masakazu Yayoshi
Estimating the term…
A small and thin IC socket allowing BGA/LGA IC package to be connected to a printed circuit board is disclosed. The IC socket includes a socket body having a plurality of main through-holes formed between the top and bottom surfaces thereof, corresponding to respective ones of the terminals of the IC. In each of the main through-holes, a pair of an upper contact member and a lower contact member which are accommodated and are electrically connected to each other. At least the upper contact member is slidably accommodated and biased to protrude from the top surface of the body. An external connection printed circuit board is fixed to the top surface of the socket body and has a plurality of upper plated through-holes corresponding to respective ones of the main through-holes. The upper contact member protrudes through a corresponding one of the upper through-holes and is electrically connected to a corresponding one of wiring conductors.
An integrated circuit (IC) socket for electrically connecting terminals formed on a bottom surface of a surface-mount IC package to respective ones of predetermined electrodes of a printed circuit board, comprising:
An integrated circuit (IC) socket for connecting input/output terminals of one of a BGA (Ball-Grid-Array) IC package and an LGA (Land-Grid-Array) which is accommodated inside the IC socket to respective ones of predetermined IC terminal connection electrodes on a mounting printed circuit board, comprising:
Dependencies are inferred from the claim text.