Wire bonding method
AssigneeKabushiki Kaisha Shinkawa
InventorShinichi Nishiura
Life of this patent
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Abstract
In a wire bonding method for connecting first and second bonding points, after bonding a primary ball to a first bonding point and then the wire to the second bonding point, a secondary ball is formed by electrical charge on a tail end of a wire that extends out of the tip end of a capillary, this secondary ball is ball-bonded to an arbitrary point near the second bonding point, and then the wire is cut so as to leave a tail of wire out of the tip end of the capillary. A primary ball is formed at the end of the tail by electrical discharge and is bonded to a next first bonding point.
Claims3
A wire bonding method in which a first bonding is performed on a first bonding point, after which a wire is delivered from a capillary and a second bonding is performed on a second bonding point so that said first bonding point and second bonding point are connected by said wire, said bonding method, after said second bonding, further comprising the steps of:
- separating said wire from said second bonding point so as to form a secondary tail in said wire extending from a tip end of said capillary,
- forming a secondary ball at an end of said secondary tail by performing a secondary discharge with an electric torch,
- ball-bonding said secondary ball at an arbitrary point other than said second bonding point,
- separating said wire from said ball-bonded secondary ball so as to form a primary tail that extends from said tip end of said capillary,
- forming a primary ball at an end of said primary tail by performing a primary discharge with said electric torch, and
- bonding said primary ball to a next first bonding point.
A wire bonding method in which a first bonding is performed on a first bonding point, after which a wire is delivered from a capillary and a second bonding is performed on a second bonding point so that said first bonding point and said second bonding point are connected by said wire, said method, after said second bonding, further comprising the steps of:
- separating said wire from said second bonding point so as to form a secondary tail in said wire extending from a tip end of said capillary,
- forming a secondary ball at an end of said secondary tail by performing a secondary discharge with an electric touch,
- ball-bonding said second ball at an arbitrary point other than said second bonding point, separating said wire from said ball-bonded secondary ball so as to form a primary tail that extends from said tip end of said capillary,
- forming a primary ball at an end of said primary tail by performing a primary discharge with said electric touch, and
- bonding said primary ball to a next first bonding point, and wherein
- said secondary ball is of large value, while said primary ball is of a small value, and
- a diameter of said secondary ball is 1.7 times a diameter of said wire or greater, and a diameter of said primary ball is 1.5 times a diameter of said wire or less.
Dependencies are inferred from the claim text.