Integrated processor mounting mechanism and heat sink
AssigneeMolex Incorporated
InventorGregory T. Wyler
Life of this patent
Estimating the term…
Abstract
An integrated heat sink/retention mechanism and a method for mounting a processor assembly on a circuit board using such an integrated heat sink/retention mechanism. The method involves attaching an integrated heat sink/retention mechanism onto the circuit board. A grounding connection may be formed between the circuit board and the integrated heat sink/retention mechanism. The integrated heat sink/retention mechanism is designed so that the heat sink is attachable to a processor assembly and mountable on a circuit board.
Claims31
An integrated heat sink and retention mechanism comprising:
- a heat sink having a series of heat conductive surfaces forming a plurality of air passageways, said heat conductive surfaces include a corrugated thermally conductive sheet forming the series of ridges and troughs, and said heat sink includes a base plate integral with said mounting extension and a clamp forcing the troughs of the corrugated thermally conductive sheet against the base plate;
- a mounting extension integral with said heat sink, said mounting extension and said heat sink providing an electrically conductive path;
- and
- an attachment device operable to attach a heat generating processor assembly to said heat sink so as to establish thermal contact between said heat sink and the heat generating processor assembly and an electrically conductive path from the heat generating processor assembly to said mounting extension.
A motherboard comprising:
- a circuit board;
- a slot connector mounted on said circuit board, said slot connector having an elongated slot;
- a heat sink;
- a processor board inserted in the elongated slot of said slot connector with said processor board oriented perpendicular to said circuit board;
- and
- a thermal plate in thermal contact with a processor on said processor board and attached to said heat sink to establish thermal contact between said heat sink and said thermal plate, said thermal plate having at least one mounting leg extending therefrom for securely mounting said heat sink on a circuit board.
An integrated heat sink and retention mechanism comprising:
- a heat sink, said heat sink includes a thermally conductive sheet folded into a series of alternating ridges and troughs, a base plate and a clamp forcing the troughs of the corrugated thermally conductive sheet against the base plate;
- means for attaching said heat sink to a processor assembly;
- and
- at least one mounting leg connected to said heat sink for securely mounting said heat sink on a circuit board.
An integrated heat sink and retention mechanism comprising:
- a heat sink having a series of heat conductive surfaces forming a plurality of air passageways, said heat conductive surfaces include a thermally conductive sheet forming a series of ridges and troughs, and said heat sink includes a base plate and a clamp forcing said troughs of said thermally conductive sheet against said base plate;
- a mounting extension extending from said heat sink, said mounting extension and said heat sink providing an electrically conductive path;
- and
- an attachment device operable to attach a heat generating processor assembly to said heat sink so as to establish thermal contact between said heat sink and the heat generating processor assembly and an electrically conductive path from the heat generating processor assembly to said mounting extension.
Dependencies are inferred from the claim text.