Stacked polish pad
AssigneeInternational Business Machines Corporation
InventorsShyng-Tsong Chen, Michael F. Lofaro, Woody Ray Smith
Life of this patent
Estimating the term…
Abstract
A polishing pad assembly is described for use in a chemical-mechanical polishing apparatus having a polishing platen. The polishing pad assembly includes a first pad disposed on the platen. The first pad comprises a sealable enclosure with a flexible outer skin and partially filled with a porous material. A control is adapted to inject fluid into and to remove fluid from the enclosure. The first pad has a hardness which is variable according to an amount of fluid in the enclosure. A second pad is disposed on the first pad.
Claims9
A polishing pad assembly for use in a chemical-mechanical polishing apparatus having a polishing platen, the polishing pad assembly comprising:
- a first pad disposed on the platen, the first pad being variably adaptable to vary hardness wherein the first pad comprises a sealable enclosure with a flexible outer skin and partially filled with a porous material;
- control means operatively associated with the first pad for varying hardness of the first pad wherein the control means comprises means for injecting a fluid into and for removing the fluid from the enclosure, wherein the first pad has a hardness which is variable according to the amount of fluid in the enclosure;
- and
- a second pad disposed on the first pad.
A polishing pad assembly for use in a chemical-mechanical polishing apparatus having a polishing platen, the polishing pad assembly comprising:
- a first pad disposed on the platen, the first pad including a sealable enclosure with a flexible outer skin and partially filled with a porous material;
- means for injecting a fluid into and for removing the fluid from the enclosure;
- and
- a second pad disposed on the first pad,
- wherein the first pad has a hardness which is variable according to an amount of fluid in the enclosure.
Dependencies are inferred from the claim text.