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US 6,267,654 B1Granted
Pad backer for polishing head of chemical mechanical polishing machine
AssigneeUnited Microelectronics Corp.
InventorsChien-Hsin Lai, Jung-Nan Tseng, Huang-Yi Lin, Hui-Shen Shih
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Abstract
A pad backer for a polishing head of a chemical mechanical polishing machine is described wherein scribe lines in the x-direction and in the y-direction are formed on the surface of the pad backer. Additional scribe lines are formed at angles of about 45 degrees and about 135 degrees from the x-direction scribe lines to increase the usage rate of the polishing pad.
Claims5
A pad backer for a polishing head of a chemical mechanical polishing machine comprising:
- a flexible platen;
- a plurality of parallel first scribe lines in a first direction;
- a plurality of parallel second scribe lines in a second direction, intersecting the first scribe lines at 90 degrees;
- a plurality of parallel third scribe lines at a first angle from the first scribe lines, passing through the intersections between the first scribe lines and the second scribe lines;
- and
- a plurality of parallel fourth scribe lines at a second angle from the first scribe lines, passing through the intersections between the first scribe lines and the second scribe lines.
3 more elements
Dependencies are inferred from the claim text.