Edge and bevel CMP of copper wafer
AssigneeIndustrial Technology Research Institute
InventorsHan-Chung Lai, Hung-Wen Chiou
Life of this patent
Estimating the term…
Abstract
A new method is provided to edge and bevel the periphery of a semiconductor substrate. The wafer is positioned in a horizontal plane and held in place against two positioning pegs. The wafer is rotated and slurry is distributed over the periphery of the substrate surface. The periphery of the wafer is entered into one or more abrasive fixtures, also referred to as bevel/edge heads. These abrasive fixtures will create the desired edge and the desired bevel around the periphery of the substrate.
Claims13
A method for removing deposits from the periphery of a substrate, comprising:
- (a) providing a substrate, said substrate having been processed and containing layers of dielectric and layers of metal deposited over the active surface of said substrate;
- (b) inserting said substrate into an arrangement of bevel/edge polishing heads, said bevel/edge polishing head comprising a polishing pad holder, said polishing pad holder having a cavity wherein are contained a bevel polishing pad and an edge polishing pad and a polishing pad support body, said bevel polishing pad and said edge polishing pad and said polishing pad support body being mounted inside said polishing pad holder in such a manner that:
- (i) said bevel polishing pad is in physical contact with the active surface of said substrate, said physical contact extending into a perimeter of said substrate over a measurable amount;
- (ii) said edge polishing pad is in physical contact with an edge of said substrate;
- (iii) said pad support body is in physical contact with the bottom surface of said substrate in such a manner as to provide support to said substrate;
- and
- (iv) the distance between said bevel polishing pad and said pad support body when measured in a direction that is perpendicular to the plane of said substrate is essentially equal to a thickness of said substrate;
- and
- (c) removing excess deposits from a periphery of said substrate.
An apparatus for removing deposits from the periphery of a substrate, comprising
- a substrate, said substrate having been processed and containing layers of dielectric and layers of metal deposited over the surface of said substrate said substrate being inserted into an arrangement of bevel/edge polishing heads, said bevel/edge polishing head comprising a polishing pad holder, said polishing pad holder having a cavity wherein are contained a bevel polishing pad and an edge polishing pad and a polishing pad support body, said bevel polishing pad and said edge polishing pad and said polishing pad support body being mounted inside said polishing pad holder in such a manner that:
- (i) said bevel polishing pad is in physical contact with the surface of said substrate, said physical contact extending into a perimeter of said substrate over a measurable amount;
- (ii) said edge polishing pad is in physical contact with an edge of said substrate;
- (iii) said pad support body is in physical contact with the bottom surface of said substrate in such a manner as to provide support to said substrate;
- and
- (iv) a distance between said bevel polishing pad and said pad support body when measured in a direction that is perpendicular to the plane of said substrate is about equal to a thickness of said substrate.
Dependencies are inferred from the claim text.