Back to results
US 6,267,577 B1Granted
Transfer molding apparatus for manufacturing semiconductor devices
AssigneeOki Electric Industry Co., Ltd.
InventorsHiroyuki Nishi, Akira Sugai
Life of this patent
Estimating the term…
Abstract
A transfer molding apparatus, wherein a top-half mold and a bottom-half mold form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any of the plurality of cavities.
Claims14
A transfer molding apparatus comprising:
- a top-half mold and a bottom-half mold that forms a cavity as a molding space for a package and a transfer pot as a loading space, the transfer pot communicating with said cavity to inject resin into said cavity;
- a plunger that forces the resin out of the transfer pot into said cavity;
- and
- a pressure adjuster that reduces the pressure in said cavity by extracting air from said cavity, when a specified amount of resin has been injected into said cavity.
1 more element
A transfer molding apparatus comprising:
- a resin mold including a cavity as a molding space for a package, and a transfer pot that provides resin to the cavity;
- a plunger that forces the resin from the transfer pot into the cavity;
- and
- a pressure adjuster that adjusts air pressure in the cavity based on an amount of the resin forced into the cavity.
1 more element
Dependencies are inferred from the claim text.