Ink jet heater chip module with sealant material

A heater chip module comprising:

• a carrier adapted to be secured to a container for receiving ink and including inner side walls and a support section which together define an inner cavity;
• an edge feed heater chip coupled to said carrier support section, said heater chip including side walls, said support section including a first passage which defines a first path for ink to travel from the container to said inner cavity, said inner cavity and said heater chip being sized such that a first side wall of said heater chip is spaced from a first inner side wall of said carrier;
• a nozzle plate coupled to said heater chip and said carrier, said nozzle plate having a width such that said nozzle plate extends over an outer surface of said carrier;
• and
• sealant material provided in said inner cavity such that at least a portion of said first inner side wall of said carrier, at least a portion of said first side wall of said heater chip, a first section of said nozzle plate and said sealant material define a first sealed ink cavity for receiving ink passing through said first passage, said sealant material comprising first and second tab portions extending down from said nozzle plate.

A flexible circuit/beater chip module assembly comprising:

• a carrier adapted to be secured to a container for receiving ink and including inner side walls and a support section which together define an inner cavity;
• an edge feed heater chip coupled to said carrier support section, said heater chip including side walls, said support section including a first passage therein which defines a first path for ink to travel from the container to said inner cavity, said inner cavity and said heater chip being sized such that a first side wall of said beater chip is spaced from a first inner side wall of said carrier;
• a nozzle plate coupled to said heater chip and said carrier, said nozzle plate having a width such that said nozzle plate extends over an outer surface of said carrier;
• sealant material provided in said inner cavity between at least one of said inner side walls of said carrier and said first side wall of said heater chip and being in contact or integral with said nozzle plate, at least a portion of said first inner side wall of said carrier, at least a portion of said first side wall of said beater chip, a first section of said nozzle plate and said sealant material defining a first sealed ink cavity for receiving ink passing through said first passage;
• and
• a flexible circuit coupled to said heater chip.