Apparatus and method of clamping semiconductor devices using sliding finger supports
AssigneeMicron Technology, Inc.
InventorMichael B. Ball
Life of this patent
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Abstract
An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.
Claims21
A clamp assembly for stabilizing at least one lead finger of a lead frame during a wire bonding process, said clamp assembly comprising:
- a primary clamp having at least one bond site window extending therethrough for receiving a semiconductor device having a periphery to be wire bonded to said at least one lead finger of said lead frame, said primary clamp having at least one surface for contacting a first surface of said at least on lead finger of said lead frame outside of the periphery of said semiconductor device;
- at least one resiliently-biased secondary clamp extending over said at least one bond site window to contact said first surface of at least one of said lead fingers of said lead frame;
- and
- a support arm for contacting a second surface of said at least one lead finger of said lead frame at a position opposite said primary clamp and said secondary clamp.
A clamp assembly for stabilizing at least one lead finger of a lead frame during a wire bonding process, said clamp assembly comprising:
- a primary clamp having at least one bond site window extending therethrough for receiving a semiconductor device having a periphery to be wire bonded to said at least one lead finger of said lead frame, said primary clamp having at least one surface for contacting a first surface of said at least on lead finger of said lead frame outside of the periphery of said semiconductor device;
- at least one secondary clamp extending over said at least one bond site window to contact said first surface of at least one of said lead fingers of said lead frame;
- and
- a support arm for contacting a second surface of said at least one lead finger of said lead frame at a position opposite said primary clamp and said secondary clamp.
Dependencies are inferred from the claim text.