Method and apparatus for application of adhesive tape to semiconductor devices

A system for applying adhesively coated material to a portion of a semiconductor die mounting site of a leadframe of a plurality of leadframes for semiconductor devices, said system comprising:

• a first source for supplying a first length of adhesively coated material at a first location of said portion of said semiconductor die mounting site of said leadframe of said plurality of leadframes;
• a second source for supplying a second length of adhesively coated material at a second location of said portion of said semiconductor die mounting site of said leadframe of said plurality of leadframes;
• indexing apparatus for supplying said plurality of leadframes for semiconductor devices in a leadframe-by-leadframe sequence at the first location and the second location of said portion of said semiconductor die mounting site;
• application apparatus configured to receive said plurality of leadframes for semiconductor devices in a leadframe-by-leadframe sequence, to receive said first length of adhesively coated material at the first location of said portion of said semiconductor die mounting site and to receive said second length of adhesively coated material at the second location of said portion of said semiconductor die mounting site, said application apparatus having cutting apparatus configured for cutting a first increment of said first length of adhesively coated material and applying said first increment to the first location of said portion of said semiconductor die mounting site of said leadframe of said plurality of leadframes and for cutting a second increment of said second length of adhesively coated material and applying said second increment to the second location of said portion of said semiconductor die mounting site of said leadframe of said plurality of leadframes after the leadframe of said plurality of leadframes has been subsequently indexed to the second location;
• and
• control apparatus in electrical communication with said indexing apparatus and configured to supply operation signals thereto to supply said plurality of leadframes for semiconductor devices in leadframe-by-leadframe sequence to said application apparatus to position the first location of said portion of said semiconductor die mounting site and the second location of said portion of said semiconductor die mounting site to receive said first increment and said second increment, respectively,
• to operate said first source to cause said first length of adhesively coated material to be selectively supplied to said application apparatus when the first location of said portion of said semiconductor die mounting site is positioned to receive said first increment;
• to operate said second source to cause said second length of adhesively coated material to be selectively supplied to said application means when the second location of said portion or said semiconductor die mounting site is positioned to receive said second increment;
• and
• to operate said cutting apparatus to selectively cut and apply said first increment to the first location of said portion of said semiconductor die mounting site of said leadframe of said plurality of leadframes and to cut and apply said second increment to the second location of said portion of said semiconductor die mounting site of said leadframe of said plurality of leadframes has been indexed to the second location.

Apparatus for application of adhesive tape to a semiconductor die mounting site of a LOC leadframe of a plurality of LOC leadframes, said apparatus comprising:

• a base;
• a block positioned proximate said base and spaced therefrom for said LOC leadframe to pass closely and freely therebetween;
• supply apparatus positioned relative to said base to supply a first tape length at a first location of said semiconductor die mounting site of said LOC leadframe and a second tape length at a second location of said semiconductor die mounting site of said LOC leadframe to said base;
• indexing apparatus for moving each LOC leadframe of said plurality of LOC leadframes relative to said base from the first location of said semiconductor die mounting site to the second location of said semiconductor die mounting site;
• application apparatus mechanically associated with said base for cutting said first tape length into a first tape decal and applying said first tape decal to the first location of said semiconductor die mounting site of an LOC leadframe positioned between said base and said block at the first location and for cutting said second tape length into a second tape decal and applying said second tape decal to the second location of said semiconductor die mounting site on a LOC leadframe positioned between said base and said block at the second location after the leadframe has been subsequently indexed to the second location, said application apparatus including a plurality of physically independent and mutually uncoupled cutting dies adapted for cutting said first and second tape lengths into said first and second tape decals;
• and control apparatus in electrical communication with said application apparatus and configured to send operational signals thereto for causing said application apparatus to cut said first tape length into said first tape decal and for applying said first tape decal to said first location of said semiconductor die mounting site on said LOC leadframe and to cut said second tape length into said second tape decal and for applying said second tape decal to a second location of said semiconductor die mounting site on said LOC leadframe positioned between said base and said block at the second location.