Apparatus and method for processing the surface of a workpiece with ozone

An apparatus for treating the surface of a workpiece comprising:

• an aqueous liquid reservoir;
• process chamber;
• a workpiece holder within the process chamber;
• nozzles within the process chamber disposed to spray liquid onto the workpiece held by the workpiece holder;
• a liquid flow line extending between the liquid reservoir and the nozzles;
• an ozone generator for generating a supply of ozone;
• one or more supply lines extending from the ozone generator to the liquid line for injecting ozone into the liquid flow line;
• and
• a heater in the liquid reservoir or in the liquid flow line.

A system for processing the surface of a semiconductor workpiece, comprising:

• an aqueous liquid reservoir for holding an aqueous liquid;
• a treatment chamber containing a rotor having supports for holding a batch of workpieces, and a plurality of nozzles connected to the liquid reservoir via a flow line, with the nozzles positioned to spray process liquid onto workpieces held by the supports, as the rotor rotates within the treatment chamber;
• a heater for heating the process liquid;
• and
• an ozone generator connected to the flow line, between the reservoir and the nozzles.

A system for processing a semiconductor wafer, comprising:

• a process chamber;
• a rotor assembly in the process chamber, with the rotor having positions for holding a plurality of wafers;
• a plurality of spray nozzles in the process chamber positioned to spray liquid onto the wafers in the rotor;
• a process liquid reservoir for holding an aqueous process liquid;
• a liquid flow line connecting the process liquid reservoir to the spray nozzles in the process chamber;
• a heater for heating the process liquid in at least one of the reservoir and the liquid flow line;
• and
• an ozone gas generator connected to the liquid flow line to deliver ozone gas into process liquid flowing from the process liquid reservoir to the spray nozzles in the chamber.