Method of gap filling a conductive slip ring
AssigneeLitton Systems, Inc.
InventorsGlenn E. Lawson, Stephen R. Cole, Anthony L. Bowman, Michael J. Day
Life of this patent
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Abstract
In a wrapped ring manufacturing process for slip ring assemblies, the assembly is heated to expand a gap between ends of the slip ring. A conductive material is then used to fill the expanded gap, to assure compression of the conductive material and to eliminate cracks therein. The filled gap is electroplated with a precious metal to form a layer of material of uniform hardness, wear resistance, electrical conductivity and environmental resistance around the entire perimeter of the slip ring.
Claims10
In a wrapped ring method for manufacturing an annular base for a slip ring assembly, wherein strips of conductive material are wrapped onto an insulating base, the improvement comprising heating at least ends of a strip of conductive material to a temperature level corresponding to a maximum operating temperature for the slip ring formed of the strip, whereby a gap between ends of the strip of conductive material is thermally expanded;
- and
- when the gap is thermally expanded, filling the gap with a rigid conductive material.
In a wrapped ring method for manufacturing an annular base for a slip ring assembly, wherein strips of conductive material are wrapped onto an insulating base, the improvement comprising heating at least ends of a strip of conductive material to a temperature level chosen to reduce tensile forces acting on a filler material added to a gap between ends of the strip of conductive material, wherein the gap is thermally expanded by the heating step;
- and
- filling the gap with a rigid conductive filler material.
Dependencies are inferred from the claim text.