Methods of making microelectronic components having electrophoretically deposited layers
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, John W. Smith, Konstantine N. Karavakis, Zlata Kovac, Joseph Fjelstad
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Abstract
A method of making a microelectronic component by providing a conductive element, providing a resist at selected locations on said conductive element and electrophoretically depositing an uncured dielectric material on the conductive element, wherein the uncured material will be deposited on the conductive element except at locations covered by the resist. The deposited material is cured to form a dielectric layer and the resist is removed so that the dielectric layer has openings extending to the conductive element at locations the locations which were covered by the resist.
Claims16
A method of making a microelectronic component comprising the steps of:
- (a) providing a conductive element;
- (b) providing a resist at selected locations on said conductive element;
- (c) depositing an uncured dielectric material on said conductive element electrophoretically, wherein said uncured material will be deposited on said conductive element except at locations covered by said resist;
- (d) curing the deposited material to form a permanent dielectric layer on said conductive element, which serves as an insulating layer in the microelectronic component after the component is completed;
- and
- (e) removing said resist, whereby said dielectric layer will have openings extending to said conductive element at the locations which were covered by said resist.
A method of making a microelectronic component comprising the steps of:
- (a) providing a conductive element;
- (b) providing a resist at selected locations on said conductive element;
- (c) depositing an uncured dielectric material on said conductive element electrophoretically, wherein said uncured material will be deposited on said conductive element except at locations covered by said resist;
- (d) curing the deposited material to form a dielectric layer on said conductive element;
- (e) removing said resist, whereby openings are created at the locations which were covered by said resist, said openings extending to said conductive element;
- and
- (f) depositing an electrically conductive structural material in said openings to thereby form conductors electrically connected to said conductive element.
A method of making a microelectronic component comprising the steps of:
- (a) providing a conductive sheet having a flat surface;
- (b) providing a resist at selected locations on said flat surface of said conductive sheet;
- (c) depositing an uncured dielectric material on said conductive sheet electrophoretically, wherein said uncured material will be deposited on said conductive sheet except at locations covered by said resist;
- (d) curing the deposited material to form a dielectric layer on said conductive sheet;
- and
- (e) removing said resist, whereby said dielectric layer will have openings extending to said conductive sheet at the locations which were covered by said resist.
A method of making a microelectronic component comprising the steps of:
- (a) providing a conductive element having a surface;
- (b) applying a resist in dots spaced apart from one another on the surface of said conductive element;
- (c) depositing an uncured dielectric material on said conductive element electrophoretically, so that said uncured material is deposited on said conductive element as a substantially continuous layer except at locations covered by said resist;
- (d) curing the deposited dielectric material;
- and
- (e) removing said resist, whereby said substantially continuous layer of cured dielectric layer will have openings extending to said conductive element at the locations which were covered by said resist.
Dependencies are inferred from the claim text.