Method and apparatus for mounting electronic components
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsNaoyuki Kitamura, Osamu Okuda, Akira Kabeshita, Takeshi Takeda
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsNaoyuki Kitamura, Osamu Okuda, Akira Kabeshita, Takeshi Takeda
Estimating the term…
Method and apparatus for mounting electronic components in which components are efficiently fed and transferred for enhancing productivity is provided. Tray draw-out device (6) is disposed at a component feeding unit (4) for pulling out a tray (3) accommodating electronic components (2) from the component feeding unit (4) to a given pick-up position, where the electronic components (2) are transferred by the transfer mechanism (11) on to a temporary holder (8) disposed on a draw-out arm (7) of the tray draw-out device (6). Mounting head (5) has a plurality of mounting nozzles (5a), with which the mounting head (5) picks up several electronic components (2) aligned on the temporary holder (8) at a time and mount them on to a circuit board (1) which has been loaded and located at a prescribed position.
An electronic component mounting apparatus in which a plurality of electronic components preliminarily aligned in a mounting order at a prescribed position are picked up and held by suction with a plurality of nozzles provided on a mounting head and mounted in succession at prescribed mounting positions on a circuit board comprising:
An electronic component mounting apparatus in which a plurality of electronic components preliminarily aligned in a mounting order at a prescribed position are picked up and held by suction with a plurality of nozzles provided on a mounting head and mounted in succession at prescribed mounting positions on a circuit board comprising:
An electronic component mounting apparatus comprising:
In an electronic component mounting apparatus for supplying component parts from a tray to a mounting head for mounting on a circuit board, the improvement comprising:
A method for mounting electronic components in which a plurality of electronic components, preliminarily aligned in a mounting order at prescribed positions, are picked up and held by suction with a plurality of nozzles provided on a mounting head and mounted in succession at prescribed mounting positions on a circuit board, comprising the steps of:
Dependencies are inferred from the claim text.