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US 6,266,872 B1Granted
Method for making a connection component for a semiconductor chip package
AssigneeTessera, Inc.
InventorJoseph Fjelstad
Life of this patent
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AssigneeTessera, Inc.
InventorJoseph Fjelstad
Estimating the term…
A method of making a microelectronic assembly includes providing a connection component including a dielectric element with electrically conductive parts, providing a fugitive material in contact with the dielectric element and providing a curable material on the dielectric element after providing the fugitive material and curing the curable material to provide a compliant element so that the fugitive material isolates the electrically conductive parts from the compliant element. The method also includes storing the connection component with the fugitive material and the compliant element. After the storing step, the fugitive material is removed from the connection component and the electrically conductive parts are then connected to a microelectronic element. The step of removing the fugitive material is generally performed less than 24 hours before the electrically conductive parts are connected together and preferably less than one hour before the parts are connected together. The fugitive material may include a liquid soluble material removable by chemical treatment, or a material which may be removed upon exposure to heat, radiation or ultraviolet light.
The method of making a microelectronic assembly comprising the steps of:
The method of making a microelectronic assembly comprising the steps of:
Dependencies are inferred from the claim text.