Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
Assignee3M Innovative Properties Company
InventorsKohichiro Kawate, Shigeyoshi Ishii, Mario A. Perez
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Abstract
A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.
Claims9
A thermosetting hot-melt adhesive composition comprising:
- an epoxy component comprising a polyethylene copolymer having epoxy groups;
- a cationic polymerization catalyst;
- and
- a thermoplastic polymer having no epoxy groups, comprising an ethylene-alkyl acrylate copolymer.
Dependencies are inferred from the claim text.